Rigaku Accelerates Development of Next-Generation Semiconductor Measurement Technology Utilizing World-Class Research Infrastructure
Rigaku, a global solution partner for X-ray analysis equipment, has expanded its development of measurement technologies for next-generation semiconductors by strengthening its collaboration with imec, a global semiconductor R&D institution. This 3-year program aims to advance Rigaku's core X-ray technologies, targeting a 50% market share in the advanced AI semiconductor field by 2030, with a projected SAM of approximately 1 billion USD.
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- 📰 Published: May 12, 2026 at 19:00
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Rigaku Corporation (Headquarters: Akishima, Tokyo; President: Jun Kawakami), a group company of Rigaku Holdings and a global solution partner for X-ray analysis equipment, is expanding the development of measurement technologies for next-generation semiconductors by leveraging a global research environment.
▲Signing ceremony held on April 9th
Rigaku has continued its collaboration with imec, a global semiconductor research and development institution based in Belgium, and has newly signed a 3-year development program. Through this collaboration, Rigaku will further advance its core X-ray technologies, including 3D device measurement, highly sensitive detection of ultra-thin films and trace elements, and non-destructive inspection of minute defects.
As the industry shifts to advanced structural designs such as GAA/CFET*1 and memory density increases, semiconductor device manufacturing processes are becoming increasingly complex. This trend is driving a greater demand for high-precision, non-destructive measurement and inspection technologies to support stable mass production. Rigaku is addressing these needs by providing differentiated measurement solutions with high added value.
This development program will focus on the following areas:
[Key Focus Areas]
Advanced Logic: Measurement and inspection technology corresponding to CFET structures
Reticle Measurement: Degradation evaluation of photomasks used in EUV lithography*2
Advanced Wiring and Packaging: Non-destructive inspection of advanced packages*3
Advanced Memory: Shape evaluation of microstructures in next-generation 3D DRAM
In the field of advanced AI semiconductors, the Serviceable Available Market (SAM) for Rigaku's measurement and inspection equipment is estimated to reach approximately 1 billion USD by 2030. Rigaku aims to capture a 50% share in this growing market by sequentially introducing high-value-added products that are unique in the industry.
Strengthening collaboration with imec is an initiative to enhance competitive advantage in the high-value-added domain of measurement and inspection within this growing market and to drive medium to long-term business growth.
*1: GAA/CFET: Technology to make transistors (components that control electric current flow) smaller and higher performance by arranging and structuring them three-dimensionally.
*2: EUV Lithography: Light technology essential for creating ultra-fine circuits, indispensable for manufacturing state-of-the-art semiconductors.
*3: Advanced Package: Packaging technology that combines multiple semiconductor chips at high density to improve performance and reduce power consumption.
[About the Rigaku Group]
The Rigaku Group is a collective of engineers driving society forward with advanced analytical technologies, including thermal analysis, centered on X-ray analysis.
As a solution partner for industrial and research analysis, Rigaku has continued to grow with customers in 136 countries and regions since its establishment in 1951. It boasts an extremely high market share in Japan, with overseas sales reaching approximately 70%. Its application fields are constantly expanding from semiconductors, electronic materials, batteries, environment and energy to life sciences. Over 2,000 employees worldwide are committed to realizing innovations that "Change the World with the Power of Vision."
For more details, please visit rigaku-holdings.com.
▲Signing ceremony held on April 9th
Rigaku has continued its collaboration with imec, a global semiconductor research and development institution based in Belgium, and has newly signed a 3-year development program. Through this collaboration, Rigaku will further advance its core X-ray technologies, including 3D device measurement, highly sensitive detection of ultra-thin films and trace elements, and non-destructive inspection of minute defects.
As the industry shifts to advanced structural designs such as GAA/CFET*1 and memory density increases, semiconductor device manufacturing processes are becoming increasingly complex. This trend is driving a greater demand for high-precision, non-destructive measurement and inspection technologies to support stable mass production. Rigaku is addressing these needs by providing differentiated measurement solutions with high added value.
This development program will focus on the following areas:
[Key Focus Areas]
Advanced Logic: Measurement and inspection technology corresponding to CFET structures
Reticle Measurement: Degradation evaluation of photomasks used in EUV lithography*2
Advanced Wiring and Packaging: Non-destructive inspection of advanced packages*3
Advanced Memory: Shape evaluation of microstructures in next-generation 3D DRAM
In the field of advanced AI semiconductors, the Serviceable Available Market (SAM) for Rigaku's measurement and inspection equipment is estimated to reach approximately 1 billion USD by 2030. Rigaku aims to capture a 50% share in this growing market by sequentially introducing high-value-added products that are unique in the industry.
Strengthening collaboration with imec is an initiative to enhance competitive advantage in the high-value-added domain of measurement and inspection within this growing market and to drive medium to long-term business growth.
*1: GAA/CFET: Technology to make transistors (components that control electric current flow) smaller and higher performance by arranging and structuring them three-dimensionally.
*2: EUV Lithography: Light technology essential for creating ultra-fine circuits, indispensable for manufacturing state-of-the-art semiconductors.
*3: Advanced Package: Packaging technology that combines multiple semiconductor chips at high density to improve performance and reduce power consumption.
[About the Rigaku Group]
The Rigaku Group is a collective of engineers driving society forward with advanced analytical technologies, including thermal analysis, centered on X-ray analysis.
As a solution partner for industrial and research analysis, Rigaku has continued to grow with customers in 136 countries and regions since its establishment in 1951. It boasts an extremely high market share in Japan, with overseas sales reaching approximately 70%. Its application fields are constantly expanding from semiconductors, electronic materials, batteries, environment and energy to life sciences. Over 2,000 employees worldwide are committed to realizing innovations that "Change the World with the Power of Vision."
For more details, please visit rigaku-holdings.com.