Iwasaki Electric Develops "UV Irradiation Equipment" Capable of Wavelength Control Filter and Monitoring Function
Iwasaki Electric has developed UV irradiation equipment for the temporary bonding tape debonding process in semiconductor manufacturing, featuring a wavelength control filter and UV monitoring function. Orders will sequentially begin in April 2026. This equipment solves variations in debonding quality by optimizing wavelength control according to tape type and stabilizing light source output, contributing to the efficiency of semiconductor manufacturing lines.
📋 Article Processing Timeline
- 📰 Published: May 11, 2026 at 20:01
- 🔍 Collected: May 11, 2026 at 11:31
- 🤖 AI Analyzed: May 12, 2026 at 04:36 (17h 4m after Collected)
UV Irradiation Equipment for Semiconductor Temporary Bonding Tape Debonding
Iwasaki Electric's Light & Environment Business Division and Iwasaki Graphics Co., Ltd. have developed UV irradiation equipment that precisely and efficiently debonds temporary bonding tapes used in the temporary bonding/debonding (TB/DB) process, which is essential in semiconductor manufacturing.
Orders will sequentially begin in April 2026.
In recent semiconductor manufacturing, as chips become thinner and stacked (3D packaging), the role of temporary bonding tapes for protecting and reinforcing wafers and chips has become increasingly important.
However, major challenges have included the fact that the optimal wavelength varies depending on the type of tape, and that changes in light source output due to long operating hours can lead to variations in debonding quality.
This product solves these challenges with its uniquely developed wavelength control filter and UV monitor & UV feedback system, providing stability and efficiency to semiconductor manufacturing lines.
UV Monitor & UV Feedback System (Example)
Processes where this equipment is utilized
This equipment can be primarily utilized in the thinning and packaging processes of semiconductor manufacturing.
After the backgrinding process: Debonding when removing thinned wafers from the support stage.
Redistribution Layer (RDL) formation: Debonding from the support substrate (carrier wafer).
After the dicing process: Debonding from the frame after reducing adhesion through UV irradiation after being cut into chips.
Our company has applied its long-cultivated lamp technology to the semiconductor manufacturing field, realizing optical solutions that meet the needs for high precision and efficiency in the temporary bonding process.
Through this product, we will contribute to the optimization of semiconductor manufacturing processes and continue to strive for the development of innovative optical technologies that anticipate market changes and customer needs.
Please check the Iwasaki Electric website for details.
Iwasaki Electric Website: Development of "UV Irradiation Equipment for Semiconductor Temporary Bonding Tape Debonding" that optimizes temporary bonding tape debonding
Keywords:
Iwasaki Electric's Light & Environment Business Division and Iwasaki Graphics Co., Ltd. have developed UV irradiation equipment that precisely and efficiently debonds temporary bonding tapes used in the temporary bonding/debonding (TB/DB) process, which is essential in semiconductor manufacturing.
Orders will sequentially begin in April 2026.
In recent semiconductor manufacturing, as chips become thinner and stacked (3D packaging), the role of temporary bonding tapes for protecting and reinforcing wafers and chips has become increasingly important.
However, major challenges have included the fact that the optimal wavelength varies depending on the type of tape, and that changes in light source output due to long operating hours can lead to variations in debonding quality.
This product solves these challenges with its uniquely developed wavelength control filter and UV monitor & UV feedback system, providing stability and efficiency to semiconductor manufacturing lines.
UV Monitor & UV Feedback System (Example)
Processes where this equipment is utilized
This equipment can be primarily utilized in the thinning and packaging processes of semiconductor manufacturing.
After the backgrinding process: Debonding when removing thinned wafers from the support stage.
Redistribution Layer (RDL) formation: Debonding from the support substrate (carrier wafer).
After the dicing process: Debonding from the frame after reducing adhesion through UV irradiation after being cut into chips.
Our company has applied its long-cultivated lamp technology to the semiconductor manufacturing field, realizing optical solutions that meet the needs for high precision and efficiency in the temporary bonding process.
Through this product, we will contribute to the optimization of semiconductor manufacturing processes and continue to strive for the development of innovative optical technologies that anticipate market changes and customer needs.
Please check the Iwasaki Electric website for details.
Iwasaki Electric Website: Development of "UV Irradiation Equipment for Semiconductor Temporary Bonding Tape Debonding" that optimizes temporary bonding tape debonding
Keywords: