TOPPAN to Exhibit at 'Total Solution Exhibition for Electronic Equipment 2026'

Key facts

  • TOPPAN to Exhibit at 'Total Solution Exhibition for Electronic Equipment 2026'
  • TOPPAN Holdings will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' starting June 10, 2026. Under the theme of 'TOPPAN's Semiconductor Packaging Solutions,' the company will showcase FC-BGA substrates and next-generation packaging technologies.
  • Source: PR Times
  • Date: June 2, 2026

Direct answer

TOPPAN Holdings will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' starting June 10, 2026. Under the theme of 'TOPPAN's Semiconductor Packaging Solutions,' the company will showcase FC-BGA substrates and next-generation packaging technologies.

Citation
TOPPAN to Exhibit at 'Total Solution Exhibition for Electronic Equipment 2026' (June 2, 2026), PR Times
Source
PR Times
Date
June 2, 2026
TOPPAN Holdings will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' starting June 10, 2026. Under the theme of 'TOPPAN's Semiconductor Packaging Solutions,' the company will showcase FC-BGA substrates and next-generation packaging technologies.
techNQ 48/100出典：PR Times

📋 Article Processing Timeline

  • 📰 Published: June 2, 2026 at 20:03
  • 🔍 Collected: June 2, 2026 at 11:20
  • 🤖 AI Analyzed: June 2, 2026 at 12:18 (58 min after Collected)
TOPPAN Inc., a group company of TOPPAN Holdings, will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' to be held at Tokyo Big Sight from June 10 to 12, 2026. This exhibition is widely recognized both domestically and internationally for showcasing the latest solutions in electronic circuits, mounting technologies, sensors, and wearable tech. At the TOPPAN booth, under the theme 'TOPPAN's Semiconductor Packaging Solutions,' the company will introduce next-generation technologies such as FC-BGA substrates, glass core FC-BGA substrates, damascene process organic RDL, and glass panel substrates. The exhibit will focus on advanced LSI technologies for data centers and network equipment, including large-scale FC-BGA for chiplet structures and substrates for Co-Packaged Optics (CPO).

FAQ

What are the features of TOPPAN's semiconductor packaging technology?

It includes high-density, high-reliability packaging technologies using glass core substrates and damascene processes.

What are the key facts in this article?

TOPPAN Holdings will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' starting June 10, 2026. Under the theme of 'TOPPAN's Semiconductor Packaging Solutions,' the company will showcase FC-BGA substrates and next-generation packaging technologies.

What is the direct answer?

TOPPAN Holdings will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' starting June 10, 2026. Under the theme of 'TOPPAN's Semiconductor Packaging Solutions,' the company will showcase FC-BGA substrates and next-generation packaging technologies.

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