Exhibition Overview and Highlights of the Panasonic Industry Booth at JPCA Show 2026
Panasonic Industry will exhibit at the JPCA Show 2026, held at Tokyo Big Sight from June 10 to June 12, 2026. The company will showcase its proprietary fine-wiring technology, "FineX(R)," applied to semiconductor packaging with its new "FineX(R) fine wiring with carrier for semiconductor packages" (development product) and transparent conductive films. These technologies aim to achieve both high-frequency performance and mounting stability. A seminar on technical approaches using existing PCB processes will also be held.
📋 Article Processing Timeline
- 📰 Published: May 25, 2026 at 20:00
- 🔍 Collected: May 25, 2026 at 11:31
- 🤖 AI Analyzed: May 26, 2026 at 21:46 (34h 14m after Collected)
Panasonic Industry Co., Ltd. will exhibit at the "JPCA Show 2026" held at Tokyo Big Sight from June 10 (Wed) to June 12 (Fri), 2026.
The company will showcase its "FineX(R)" transparent conductive film utilizing proprietary fine-wiring technology, and the "FineX(R) fine wiring with carrier for semiconductor packages" (development product), which applies "FineX(R)" technology. The newly developed fine wiring for semiconductor packages achieves both high-frequency performance and mounting stability through high-precision and smooth Cu (copper) wiring formation technology with a line width of 2–10 μm, contributing to the evolution of next-generation semiconductor packages.
In addition, at the exhibitor seminar on June 10, 2026, the company will introduce a new approach using "FineX(R) fine wiring with carrier" to achieve both high-frequency support and miniaturization using existing PCB processes and film-type substrate materials.
Exhibition Name: JPCA Show 2026
Dates: June 10 (Wed) – June 12 (Fri), 2026
Venue: Tokyo Big Sight, East Exhibition Hall, East Hall 7
Booth Number: 7C-03
■ "FineX(R) Fine Wiring with Carrier for Semiconductor Packages" (development product)
This product applies the fine-wiring technology of "FineX(R)," developed through our proprietary method, to semiconductor packaging. It stabilizes the line width and thickness of Cu wiring, improving high-frequency performance. With smooth wiring surfaces created by the etching-less method and low-warp structures utilizing glass carriers, it contributes to high-speed transmission, low loss, and high-density mounting.
■ "FineX(R)" Transparent Conductive Film
This is a transparent conductive film that achieves both high transparency and low resistance through fine Cu mesh wiring. It can be developed for a wide range of applications such as transparent heaters, antennas, and shields.
■ Seminar Information
Date and Time: June 10, 2026 (Wed) 14:00–15:00
Venue: Seminar Hall 11
Theme: High-Frequency and Miniaturization Support for Printed Circuit Boards Using Existing PCB Processes & Film-Type Substrate Materials
The company will showcase its "FineX(R)" transparent conductive film utilizing proprietary fine-wiring technology, and the "FineX(R) fine wiring with carrier for semiconductor packages" (development product), which applies "FineX(R)" technology. The newly developed fine wiring for semiconductor packages achieves both high-frequency performance and mounting stability through high-precision and smooth Cu (copper) wiring formation technology with a line width of 2–10 μm, contributing to the evolution of next-generation semiconductor packages.
In addition, at the exhibitor seminar on June 10, 2026, the company will introduce a new approach using "FineX(R) fine wiring with carrier" to achieve both high-frequency support and miniaturization using existing PCB processes and film-type substrate materials.
Exhibition Name: JPCA Show 2026
Dates: June 10 (Wed) – June 12 (Fri), 2026
Venue: Tokyo Big Sight, East Exhibition Hall, East Hall 7
Booth Number: 7C-03
■ "FineX(R) Fine Wiring with Carrier for Semiconductor Packages" (development product)
This product applies the fine-wiring technology of "FineX(R)," developed through our proprietary method, to semiconductor packaging. It stabilizes the line width and thickness of Cu wiring, improving high-frequency performance. With smooth wiring surfaces created by the etching-less method and low-warp structures utilizing glass carriers, it contributes to high-speed transmission, low loss, and high-density mounting.
■ "FineX(R)" Transparent Conductive Film
This is a transparent conductive film that achieves both high transparency and low resistance through fine Cu mesh wiring. It can be developed for a wide range of applications such as transparent heaters, antennas, and shields.
■ Seminar Information
Date and Time: June 10, 2026 (Wed) 14:00–15:00
Venue: Seminar Hall 11
Theme: High-Frequency and Miniaturization Support for Printed Circuit Boards Using Existing PCB Processes & Film-Type Substrate Materials
FAQ
パナソニック インダストリーがJPCA Show 2026で出展する主な製品は何ですか？
「FineX(R) 半導体パッケージ向けキャリア付き微細配線」（開発品）および透明導電フィルム「FineX(R)」です。
「FineX(R) 半導体パッケージ向けキャリア付き微細配線」の主な特徴は何ですか？
線幅2～10 μmのCu配線形成技術により高周波特性と実装安定性を両立し、エッチングレス工法による平滑な配線表面とガラスキャリアによる低反り構造を実現しています。
JPCA Show 2026の開催期間と会場はどこですか？
2026年6月10日（水）から6月12日（金）まで、東京ビッグサイト 東展示棟 東7ホールで開催されます。
透明導電フィルム「FineX(R)」はどのような用途に使用されますか？
透明ヒーター、透明アンテナ、透明シールドなど、次世代モビリティ、通信、産業機器分野での活用が期待されています。
セミナーではどのような内容が講演されますか？
2026年6月10日に、既存PCB工程とフィルム型基板材料を活用し、高周波対応と微細化対応を両立するための「FineX(R) キャリア付き微細配線」での新たなアプローチについて講演します。