GUC and VSORA Showcase 'Jotunn8' AI Inference Processor at TSMC Europe Technology Symposium

Hsinchu, Taiwan — May 26, 2026 — Global Unichip Corporation (GUC), a leader in advanced ASICs, will showcase the 'Jotunn8', a next-generation AI inference processor for data centers developed by VSORA, at the TSMC Europe Technology Symposium.

This exhibition demonstrates the successful collaboration between GUC and VSORA, merging advanced AI architecture with cutting-edge ASIC implementation and packaging technologies to deliver high-performance and scalable AI inference solutions for data center workloads.

Advanced AI Inference Through Close Collaboration

'Jotunn8' is VSORA's flagship AI inference processor, specifically designed for inference workloads. By eliminating the memory wall bottleneck, it achieves ultra-low latency and extremely high throughput, enabling the cost-effective deployment of large-scale AI models.

GUC provided comprehensive turnkey ASIC services for the development of 'Jotunn8', covering the entire process from netlist to manufacturing. This project showcases GUC's high technical proficiency in complex system integration, including the following:

- Design and integration of advanced chiplet architectures
- High-bandwidth memory integration using HBM3E PHY and controllers
- 2.5D die-to-die connectivity leveraging GUC's 17.2Gbps 'GLink-2.5D' interconnect
- Advanced packaging implementation utilizing TSMC's CoWoS®-S technology (3x reticle size)
- Implementation on the TSMC 5nm process node
- System-wide co-optimization of signal, power, and thermal integrity (SI/PI/TI)

This collaboration strongly indicates GUC's ability to deliver complex AI and HPC ASICs with optimized performance, power, and scalability.

Leveraging a Strong Ecosystem with TSMC

'Jotunn8' symbolizes the strength of the long-standing cooperative relationship between GUC and TSMC. As a key partner in TSMC's Open Innovation Platform® (OIP) ecosystem, GUC supports the efficient adoption of advanced process nodes and packaging technologies, bridging innovative architectures with cutting-edge manufacturing techniques.

By leveraging TSMC's advanced CoWoS® packaging technology and 5nm process technology, GUC achieves the high-quality silicon manufacturing and reliable mass production required by demanding, advanced AI applications.

'We are honored to showcase "Jotunn8" at the TSMC Europe Technology Symposium. This achievement symbolizes our strong partnership with VSORA and proves GUC's ability to utilize advanced process and packaging technologies to materialize complex AI processors into actual silicon.'

— Patrick Wang, Vice President and Chief Sales Officer, GUC

'"Jotunn8" is designed to bring efficiency and scalability in AI inference to a new level. The collaboration with GUC has played a crucial role in successfully realizing this architecture into a high-performance silicon solution.'

— Khaled Maalej, CEO, VSORA

Driving Next-Generation Data Center AI

Through this partnership, GUC and VSORA are addressing the growing demand for 'high performance and high energy efficiency' AI inference in hyperscale data centers.

'Jotunn8' takes throughput and latency optimization to a new level, supporting large-scale AI deployment and implementation across cloud and enterprise environments.

About GUC (GLOBAL UNICHIP CORP.)

GLOBAL UNICHIP CORP. (GUC) is a leading advanced ASIC company providing the highest standard of IC implementation and SoC manufacturing services to the semiconductor industry by utilizing cutting-edge process and packaging technologies. Headquartered in Hsinchu, Taiwan, it has established a global footprint with locations in China, Europe, Japan, Korea, North America, and Vietnam, earning global trust. GUC is listed on the Taiwan Stock Exchange (Stock Code: 3443).

For more information, please visit the official website (www.guc-asic.com).

About VSORA

VSORA is a fabless semiconductor company developing AI inference infrastructure that operates highly efficiently in large-scale deployments.