Entegris and JSR/Inpria Announce Cross-License Agreement for EUV Lithography
Semiconductor material leaders Entegris and JSR (Inpria's parent) have signed a non-exclusive cross-license agreement for EUV lithography technology. Focusing on Metal Oxide Resist (MOR) patents, the deal settles ongoing IP disputes and initiates exploration of broad collaboration in resist design, precursors, and filtration systems for next-gen manufacturing.
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- 📰 Published: May 27, 2026 at 17:00
- 🔍 Collected: May 27, 2026 at 08:31
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Entegris, Inc., a global leader in advanced materials and high-purity solutions for the semiconductor industry, and JSR Corporation, a leader in material innovation and the parent company of Inpria Corporation, today announced a non-exclusive cross-license agreement aimed at supporting the advancement of extreme ultraviolet (EUV) lithography for next-generation chip manufacturing.
Under this agreement, Entegris and Inpria will cross-license patents related to metal oxide resists (MOR), terminating the pending Inter Partes Review (IPR2025-00267). The parties will also explore potential for future collaboration on photoresist materials. This collaboration may cover resist design, precursor synthesis and development, as well as high-purity filtration technology and related delivery systems essential for stable performance in high-volume MOR manufacturing for EUV applications.
By combining JSR and Inpria's comprehensive leadership in MOR materials with Entegris’ expertise in MOR precursors for CVD deposition, material handling, and high-purity filtration, the collaboration aims to expand the application of advanced materials in semiconductor manufacturing as both companies scale for the AI era.
Olivier Blachier, SVP and Chief Strategy & Innovation Officer at Entegris, noted that the agreement demonstrates ecosystem-wide progress, helping customers adopt next-gen lithography with confidence. Toru Kimura, Senior Executive Officer at JSR, added that merging Inpria’s innovative technology with Entegris’ purification know-how will broaden the scope of these technologies in the semiconductor material ecosystem.
Under this agreement, Entegris and Inpria will cross-license patents related to metal oxide resists (MOR), terminating the pending Inter Partes Review (IPR2025-00267). The parties will also explore potential for future collaboration on photoresist materials. This collaboration may cover resist design, precursor synthesis and development, as well as high-purity filtration technology and related delivery systems essential for stable performance in high-volume MOR manufacturing for EUV applications.
By combining JSR and Inpria's comprehensive leadership in MOR materials with Entegris’ expertise in MOR precursors for CVD deposition, material handling, and high-purity filtration, the collaboration aims to expand the application of advanced materials in semiconductor manufacturing as both companies scale for the AI era.
Olivier Blachier, SVP and Chief Strategy & Innovation Officer at Entegris, noted that the agreement demonstrates ecosystem-wide progress, helping customers adopt next-gen lithography with confidence. Toru Kimura, Senior Executive Officer at JSR, added that merging Inpria’s innovative technology with Entegris’ purification know-how will broaden the scope of these technologies in the semiconductor material ecosystem.
FAQ
インテグリスとJSRが合意した主な内容は何ですか?
極端紫外線(EUV)リソグラフィ技術、特にメタルオキサイドレジスト(MOR)に関連する特許の非独占的クロスライセンス契約の締結です。
この契約によって解決される法的な争いはありますか?
現在係争中であった当事者系レビュー(IPR2025-00267)が終了し、知的財産に関する懸念が解消されます。
メタルオキサイドレジスト(MOR)とは何ですか?
半導体の微細化(EUV工程)に不可欠な次世代レジスト材料です。JSR/Inpriaが材料面でリードし、インテグリスは供給や精製技術に強みを持ちます。
将来的な協業にはどのような分野が含まれますか?
レジスト設計、プリカーサーの合成、高純度ろ過技術、およびそれらを安定して供給するシステムなどが検討されています。
この合意が顧客に与えるメリットは何ですか?
先端材料の信頼性と供給体制が強化されることで、顧客は確信を持って次世代リソグラフィ技術を導入できるようになります。