Mr. Hiroyuki Fujieda of Hitachi Building Systems Wins Global Electronics Association's "IPC Soldering Contest 2026 Japan Tournament"
Mr. Hiroyuki Fujieda of Hitachi Building Systems has won the "IPC Soldering Contest 2026 Japan Tournament," hosted by the Global Electronics Association. He will represent Japan at the world championship in Munich this November.
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- 📰 Published: May 16, 2026 at 01:16
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The Global Electronics Association, an international standards organization for electronics companies, has announced the results of the "IPC Soldering Contest 2026 Japan Tournament," held from May 13 to 15, 2026, at [Kansai] NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo (venue: INTEX Osaka). In this tournament, Mr. Hiroyuki Fujieda of Hitachi Building Systems Co., Ltd. won first place, Mr. Tomoki Hara of Mitsubishi Electric Corporation's Electronic and Communication Systems Works took second, and Mr. Masaki Nakamichi of Panasonic Connect Co., Ltd. secured third place.
The winner, Mr. Hiroyuki Fujieda, will represent Japan at the "2026 IPC Hand Soldering World Championship" in Munich, Germany, this November. He will compete for the world title against representatives who have won regional qualifiers from around the globe.
From left: Tomoki Hara, Hiroyuki Fujieda, Masaki Nakamichi
For this year's Japan tournament, 130 participants took part in an online preliminary academic test on IPC standards in February, and the 32 who passed advanced to the main competition at Kansai NEPCON JAPAN.
In the competition, participants performed advanced assembly work within a 45-minute time limit based on international standards: IPC-A-610 (Acceptability of Electronic Assemblies), J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies), and IPC-7711/21 (Rework, Modification and Repair of Electronic Assemblies) Class 3 (High Performance/Harsh Environment Electronic Products).
Participants tackled a comprehensive printed circuit board assembly task that included removing and installing surface mount components like semiconductor chips and QFPs (Quad Flat Packages), as well as through-hole components, and functional testing. Mr. Hiroyuki Fujieda received the highest evaluation in a highly rigorous judging process based on IPC standards, excelling in quality assessment according to IPC-A-610 and J-STD-001, and in the procedures and quality of rework/repair according to IPC-7711/21.
Hand soldering remains a critically important process in printed circuit board assembly. By adhering to proper procedures, standards, and best practices to correctly connect electronic components to the board, it is possible to form high-quality, reliable thermal and mechanical joints.
The world championship, hosted by the Global Electronics Association, is an international competition to determine the pinnacle of soldering technology. At the 2025 competition in Munich, Germany, 15 regional champions from 12 countries, including Japan, gathered, with representatives from China, France, and Hungary winning first, second, and third place, respectively.
At the upcoming world championship at "electronica 2026," an international trade fair for electronic components in Germany this November, national representatives will assemble a more complex circuit board within a 60-minute time limit and will be comprehensively scored on "functionality," "process compliance," and "overall product quality."
The IPC Soldering Contest 2026 Japan Tournament was held with the support of the following sponsors:
Premium Sponsors: JBC Soldering Japan K.K., Japan unix Co.,Ltd.
Material Sponsors: Senju Metal Industry Co., Ltd., Nihon Superior Co., Ltd., Kaken-Tech Co.,Ltd., NIHON BONKOTE CO., LTD.
About the Global Electronics Association
The Global Electronics Association is the global representative body for the electronics industry, working with thousands of member companies and partners worldwide to build more resilient and sustainable supply chains. Advocating for fair trade, appropriate regulations, and regional manufacturing revitalization, we strongly support the development of next-generation industries through industry knowledge, practical information, and education on technological innovation. The association collaborates with governments and companies worldwide to promote a trusted and thriving electronics industry. Evolving from its former name IPC, the association serves the $6 trillion electronics market and has offices in Asia Pacific, Europe, North America, and Latin America. For more details, please visit www.electronics.org.
The winner, Mr. Hiroyuki Fujieda, will represent Japan at the "2026 IPC Hand Soldering World Championship" in Munich, Germany, this November. He will compete for the world title against representatives who have won regional qualifiers from around the globe.
From left: Tomoki Hara, Hiroyuki Fujieda, Masaki Nakamichi
For this year's Japan tournament, 130 participants took part in an online preliminary academic test on IPC standards in February, and the 32 who passed advanced to the main competition at Kansai NEPCON JAPAN.
In the competition, participants performed advanced assembly work within a 45-minute time limit based on international standards: IPC-A-610 (Acceptability of Electronic Assemblies), J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies), and IPC-7711/21 (Rework, Modification and Repair of Electronic Assemblies) Class 3 (High Performance/Harsh Environment Electronic Products).
Participants tackled a comprehensive printed circuit board assembly task that included removing and installing surface mount components like semiconductor chips and QFPs (Quad Flat Packages), as well as through-hole components, and functional testing. Mr. Hiroyuki Fujieda received the highest evaluation in a highly rigorous judging process based on IPC standards, excelling in quality assessment according to IPC-A-610 and J-STD-001, and in the procedures and quality of rework/repair according to IPC-7711/21.
Hand soldering remains a critically important process in printed circuit board assembly. By adhering to proper procedures, standards, and best practices to correctly connect electronic components to the board, it is possible to form high-quality, reliable thermal and mechanical joints.
The world championship, hosted by the Global Electronics Association, is an international competition to determine the pinnacle of soldering technology. At the 2025 competition in Munich, Germany, 15 regional champions from 12 countries, including Japan, gathered, with representatives from China, France, and Hungary winning first, second, and third place, respectively.
At the upcoming world championship at "electronica 2026," an international trade fair for electronic components in Germany this November, national representatives will assemble a more complex circuit board within a 60-minute time limit and will be comprehensively scored on "functionality," "process compliance," and "overall product quality."
The IPC Soldering Contest 2026 Japan Tournament was held with the support of the following sponsors:
Premium Sponsors: JBC Soldering Japan K.K., Japan unix Co.,Ltd.
Material Sponsors: Senju Metal Industry Co., Ltd., Nihon Superior Co., Ltd., Kaken-Tech Co.,Ltd., NIHON BONKOTE CO., LTD.
About the Global Electronics Association
The Global Electronics Association is the global representative body for the electronics industry, working with thousands of member companies and partners worldwide to build more resilient and sustainable supply chains. Advocating for fair trade, appropriate regulations, and regional manufacturing revitalization, we strongly support the development of next-generation industries through industry knowledge, practical information, and education on technological innovation. The association collaborates with governments and companies worldwide to promote a trusted and thriving electronics industry. Evolving from its former name IPC, the association serves the $6 trillion electronics market and has offices in Asia Pacific, Europe, North America, and Latin America. For more details, please visit www.electronics.org.