TSMC: AI Applications Expanding, Asia-Pacific Wafer Usage Last Year Stacked Height Exceeded 3 Taipei 101s

TSMC emphasized the expansion of AI applications and the penetration into edge computing at the Taiwan Technology Symposium. They announced that over 2.1 million 12-inch equivalent wafers were used by Asia-Pacific customers last year, exceeding the height of three Taipei 101 buildings.
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  • 📰 Published: May 14, 2026 at 11:41
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Central News Agency

(Central News Agency reporter Zhang Jianzhong, Hsinchu, May 14) TSMC today held the Taiwan Technology Symposium. Wan Ruiyang, head of Asia-Pacific Business Development, stated that artificial intelligence (AI) is deeply penetrating edge computing, and smartphones are gradually becoming personal AI assistants. TSMC's Asia-Pacific customers used over 2.1 million 12-inch equivalent wafers last year, with a vertical stacking height of approximately 1600 meters, exceeding three Taipei 101 buildings.

The TSMC Taiwan Technology Symposium kicked off today at the Sheraton Hsinchu Hotel. Wan Ruiyang said that AI is continuously expanding outwards and becoming increasingly popular, injecting new momentum into human progress.

Wan Ruiyang stated that larger models are being executed in cloud and data center servers, handling more complex and faster simulation analysis and computing tasks. The growing generative AI applications and agent AI workflows are consuming tokens at an exponential rate.

He said that these simulation computations and agent AI can help accelerate drug development, scientific discovery, faster and more efficient manufacturing, and even improve overall work efficiency. Behind all this, the extreme demands on the AI infrastructure supply chain are constantly increasing, including ultimate computing density, high-bandwidth data transmission, efficient power supply, and heat dissipation capabilities.

Edge Computing Encyclopedia

Why has edge computing emerged?

In the past, when large amounts of data needed to be accessed, it was processed through cloud computing. However, transmitting data to the cloud via the network might encounter problems such as insufficient bandwidth or poor network conditions leading to delays.

What is edge computing?

Edge computing involves adding computing devices near the data source to process data. Compared to the cloud, the speed of uploading and re-downloading becomes faster, and offline analysis can also be done directly without worrying about network problems. Therefore, it was predicted that by 2022, as much as 75% of data would be processed and stored at the edge.

Where is edge computing suitable for use?

In recent years, artificial intelligence applications have particularly emphasized real-time image analysis and recognition processing capabilities, which require rapid response within milliseconds or microseconds. Therefore, applications like autonomous vehicles, AR/VR, and drones are very suitable for using edge computing.

(Data sources: ITRI, Central News Agency)

Wan Ruiyang pointed out that from semiconductor component manufacturing to advanced packaging solutions, TSMC can provide industry-leading manufacturing technology for AI-required chips. Last year, TSMC's Asia-Pacific customers collectively used over 2.1 million 12-inch equivalent wafers, and the vertical stacking height of these wafers was approximately 1600 meters, exceeding three Taipei 101 buildings.

Wan Ruiyang said that these wafers helped customers achieve mass production of approximately 2600 products, including various applications such as mobile phone chips, power chips, solid-state drives, consumer electronics, network communications, USB, display and video, and automotive electronics.

TSMC's Asia-Pacific customers launched approximately 400 new products last year, which is equivalent to more than one product entering mass production every day on average. TSMC helps achieve the smooth mass production of various differentiated products. We look forward to more cooperation opportunities in the future to continue advancing together in AI-related industries. (Editor: Zhang Liangzhi) 1150514

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