TSMC Issues NT$18.4 Billion Green Bonds for Green Building and Environmental Expenditures

(Hsinchu, May 13, Central News Agency reporter Chang Chien-chung) Wafer foundry giant Taiwan Semiconductor Manufacturing Company (TSMC) today resolved to issue NT$18.4 billion in unsecured ordinary corporate bonds, which are green bonds. The funds raised will be used for green building and green environmental protection-related expenditures.

TSMC announced today the issuance of NT$18.4 billion in unsecured ordinary corporate bonds. Of this, Class A bonds, with a 5-year term, will amount to NT$13.7 billion, and Class B bonds, with a 10-year term, will amount to NT$4.7 billion.

Class A bonds will have a fixed annual interest rate of 1.8%, and Class B bonds will have a fixed annual interest rate of 1.85%. TSMC stated that KGI Securities will be appointed as the lead underwriter, and the funds raised will be used for green building and green environmental protection-related expenditures.

To meet the funding needs for capacity expansion and green-related expenditures, TSMC's board of directors approved in February 115 (2026) the phased issuance of unsecured ordinary corporate bonds within a NT$60 billion limit in the domestic market. The NT$18.4 billion unsecured ordinary corporate bonds announced by TSMC today are the second series of corporate bonds for the year 115 (2026). (Edited by Chang Chun-mao) 1150513