ASE and Nanzih Electronics Partner to Invest NT5.2 Billion in Kaohsiung Plant Expansion
ASE Technology Holding and Nanzih Electronics announced a NT5.2 billion investment to expand their advanced packaging plant in Kaohsiung. The new facility will focus on advanced AI packaging technologies for applications in AI, cloud computing, and autonomous driving. It is expected to be operational by September 2029 and will create approximately 2,050 jobs.
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- 📰 Published: May 8, 2026 at 18:51
- 🔍 Collected: May 8, 2026 at 19:02 (10 min after Published)
- 🤖 AI Analyzed: May 8, 2026 at 21:33 (2h 31m after Collected)
Central News Agency (CNA), Kaohsiung, 8th — ASE Technology Holding has partnered with Nanzih Electronics to promote a plant expansion investment plan, spending NT5.2 billion to deploy advanced packaging capacity. A groundbreaking ceremony for the new factory was held today at the Nanzih Technology Industrial Park in Kaohsiung. The plant is expected to be operational by September 2029, creating approximately 2,050 job opportunities.
ASE and Nanzih Electronics held a joint investment press conference today, announcing a strategic partnership to co-construct a modern advanced packaging plant in the Nanzih Technology Industrial Park. ASE stated that the new plant will focus on advanced AI packaging technologies, introducing processes such as fan-out packaging and flip-chip packaging for high-end applications in AI, cloud computing, and autonomous driving.
ASE Executive Vice President Hung Sung-chi stated that this investment will create the largest single-base landmark building within the park, expanding advanced packaging and testing capacity through economies of scale and demonstrating Taiwan''s global competitiveness in the field of advanced AI packaging and testing. Furthermore, the collaboration with Nanzih Electronics will enhance land use efficiency and drive the overall upgrade of the park.
ASE pointed out that with the rapid expansion of demand for AI, high-performance computing, and data centers, the demand for chip stacking, chiplet integration, and advanced packaging technologies is rising simultaneously, deepening the collaboration between the wafer foundry and packaging and testing industries. The market forecasts that the global semiconductor market will maintain a growth trend through this year.
According to the plan, the new plant will have a base area of approximately 17,637 square meters and will consist of an 8-story building above ground and a 2-story basement, with a total floor area of about 113,402 square meters. It will also house the park''s first 161kV substation to enhance power supply stability and operational resilience.
Furthermore, the plant will be designed according to Gold-level green building standards, incorporating energy-saving, carbon reduction, and smart manufacturing concepts to increase automation, reduce operating costs, and move towards the goal of net-zero emissions.
Yang Chih-ching, Director-General of the Industrial Park Administration, Ministry of Economic Affairs, stated that they will continue to strengthen the industrial spatial layout in southern Taiwan with a focus on intelligence, safety, and sustainability.
Liao Tai-hsiang, Director-General of the Kaohsiung City Economic Development Bureau, pointed out that Kaohsiung is at the strategic core of the global semiconductor industry. This project is located in a key area of the semiconductor S-corridor and can connect with TSMC''s advanced processes and AMD''s silicon photonics R&D capabilities, promoting Kaohsiung''s transformation from a manufacturing base to an AI R&D hub. (Editor: Hsieh Ya-chu) 1150508
ASE and Nanzih Electronics held a joint investment press conference today, announcing a strategic partnership to co-construct a modern advanced packaging plant in the Nanzih Technology Industrial Park. ASE stated that the new plant will focus on advanced AI packaging technologies, introducing processes such as fan-out packaging and flip-chip packaging for high-end applications in AI, cloud computing, and autonomous driving.
ASE Executive Vice President Hung Sung-chi stated that this investment will create the largest single-base landmark building within the park, expanding advanced packaging and testing capacity through economies of scale and demonstrating Taiwan''s global competitiveness in the field of advanced AI packaging and testing. Furthermore, the collaboration with Nanzih Electronics will enhance land use efficiency and drive the overall upgrade of the park.
ASE pointed out that with the rapid expansion of demand for AI, high-performance computing, and data centers, the demand for chip stacking, chiplet integration, and advanced packaging technologies is rising simultaneously, deepening the collaboration between the wafer foundry and packaging and testing industries. The market forecasts that the global semiconductor market will maintain a growth trend through this year.
According to the plan, the new plant will have a base area of approximately 17,637 square meters and will consist of an 8-story building above ground and a 2-story basement, with a total floor area of about 113,402 square meters. It will also house the park''s first 161kV substation to enhance power supply stability and operational resilience.
Furthermore, the plant will be designed according to Gold-level green building standards, incorporating energy-saving, carbon reduction, and smart manufacturing concepts to increase automation, reduce operating costs, and move towards the goal of net-zero emissions.
Yang Chih-ching, Director-General of the Industrial Park Administration, Ministry of Economic Affairs, stated that they will continue to strengthen the industrial spatial layout in southern Taiwan with a focus on intelligence, safety, and sustainability.
Liao Tai-hsiang, Director-General of the Kaohsiung City Economic Development Bureau, pointed out that Kaohsiung is at the strategic core of the global semiconductor industry. This project is located in a key area of the semiconductor S-corridor and can connect with TSMC''s advanced processes and AMD''s silicon photonics R&D capabilities, promoting Kaohsiung''s transformation from a manufacturing base to an AI R&D hub. (Editor: Hsieh Ya-chu) 1150508