ASE Technology Holding Group Launches Strategic Planning to Tackle AI Silicon Photonics CPO Solutions
ASE Technology Holding's subsidiary, Universal Scientific Industrial (USI), has initiated strategic planning to focus on AI silicon photonics CPO solutions. Through its subsidiary EugenLight Technologies, USI will deploy 800G optical engines, optical modules, and key CPO components and solutions, entering the AI optical interconnect market.
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- 📰 Published: May 7, 2026 at 12:52
- 🔍 Collected: May 7, 2026 at 13:01 (9 min after Published)
- 🤖 AI Analyzed: May 7, 2026 at 13:19 (17 min after Collected)
Central News Agency (Taipei, May 7) -- ASE Technology Holding's subsidiary, Universal Scientific Industrial (USI), announced that this year it will complete its 800G product OEM business, from optical engines to optical modules. Through its subsidiary EugenLight Technologies, USI is strategically deploying key components and solutions for silicon photonics Co-Packaged Optics (CPO), entering the field of optical interconnects for artificial intelligence (AI) applications.
USI stated that CPO is the mainstream development direction for next-generation optical interconnect technology. From EugenLight, USI, to the ASE Group, CPO business strategic planning has been initiated, providing solutions from chip packaging and testing to Detachable Fiber Array Unit (D-FAU) assembly, External Laser Small Form-factor Pluggable (ELSFP) light sources, and switch assembly.
In January this year, USI acquired control of EugenLight Technologies in Chengdu, China, indirectly entering the high-speed optoelectronic integrated components and optical engine products market, and strategically positioning itself in the artificial intelligence (AI) silicon photonics field.
USI pointed out that EugenLight's integration into USI provides an opportunity to combine with ASE Group's advanced packaging technology, complement optical integration and packaging capabilities, and achieve technological leadership and market position in next-generation CPO products.
USI stated at a recent investor conference that Co-Packaged Optics and Data Center Interconnect (DCI) components are EugenLight's core products. The first sample of External Laser Small Form-factor Pluggable (ELSFP) was completed in March this year, with an optimized version planned for June. Product certification with several customers is currently being arranged.
In terms of DCI business, USI noted that EugenLight can mass-produce 400G and 800G related high-end laser components (nano ITLA products) and is accelerating the research and development of 1.6T related high-speed interconnect products.
Regarding production capacity layout in Vietnam, USI revealed that the initial phase of optical engine production capacity can be established by the end of June to meet North American customer demand. The expansion rate will accelerate in the third quarter, with future plans to continuously double the production capacity for optical engines and optical module assembly and testing. (Editor: Chang Liang-chih) 1150507
USI stated that CPO is the mainstream development direction for next-generation optical interconnect technology. From EugenLight, USI, to the ASE Group, CPO business strategic planning has been initiated, providing solutions from chip packaging and testing to Detachable Fiber Array Unit (D-FAU) assembly, External Laser Small Form-factor Pluggable (ELSFP) light sources, and switch assembly.
In January this year, USI acquired control of EugenLight Technologies in Chengdu, China, indirectly entering the high-speed optoelectronic integrated components and optical engine products market, and strategically positioning itself in the artificial intelligence (AI) silicon photonics field.
USI pointed out that EugenLight's integration into USI provides an opportunity to combine with ASE Group's advanced packaging technology, complement optical integration and packaging capabilities, and achieve technological leadership and market position in next-generation CPO products.
USI stated at a recent investor conference that Co-Packaged Optics and Data Center Interconnect (DCI) components are EugenLight's core products. The first sample of External Laser Small Form-factor Pluggable (ELSFP) was completed in March this year, with an optimized version planned for June. Product certification with several customers is currently being arranged.
In terms of DCI business, USI noted that EugenLight can mass-produce 400G and 800G related high-end laser components (nano ITLA products) and is accelerating the research and development of 1.6T related high-speed interconnect products.
Regarding production capacity layout in Vietnam, USI revealed that the initial phase of optical engine production capacity can be established by the end of June to meet North American customer demand. The expansion rate will accelerate in the third quarter, with future plans to continuously double the production capacity for optical engines and optical module assembly and testing. (Editor: Chang Liang-chih) 1150507