Wha Yu Industrial Co., Ltd. to mass produce 1.6T optical transceiver module in Q4, targeting hyperscale cloud data centers

Taiwanese network communication company Wha Yu Industrial Co., Ltd. announced the successful development of a next-generation 1.6T OSFP optical transceiver module in collaboration with NewPhotonics, with mass production slated for Q4 this year, targeting hyperscale cloud data centers.
新製品NQ 0/100出典:PR Times

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  • 📰 Published: May 6, 2026 at 16:36
  • 🔍 Collected: May 6, 2026 at 17:01 (25 min after Published)
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Central News Agency

(Central News Agency reporter Pan Chih-yi, Taipei, 6th) Following the launch of its 800G LPO optical module last year, network communication company Wha Yu Industrial Co., Ltd. today announced the successful development of a next-generation 1.6T OSFP optical transceiver module in collaboration with NewPhotonics. The market target is hyperscale cloud data centers, with mass production expected in the fourth quarter of this year.

Wha Yu stated that the aforementioned module adopts highly integrated packaging technology and provides advanced digital signal processing functions. It is a new generation low-power optical transceiver module that can support large-scale graphics processing unit (GPU) clusters and artificial intelligence (AI) computing infrastructure.

Wha Yu explained that the AiPhoton 1.6T optical module is equipped with NewPhotonics' NPG10204 DR8 PIC transmission chip, a pioneer in optical integrated circuits. This latest pluggable module, based on PIC technology, is designed for the expansion and interconnection of hyperscale AI data centers. It not only simplifies the manufacturing process of optical integrated circuits but also provides advanced digital signal processing (DSP) functions under an 8-channel (224Gbps per channel) architecture.

In addition, this multi-channel single-chip microcontroller integrates lasers and modulators, providing low-power, high-signal integrity single-mode PAM4 (4-level pulse amplitude modulation) signals, suitable for 200G per channel application requirements. Through highly integrated flip-chip packaging technology, lasers are integrated, simplifying complex optical assembly and wire-bonding procedures, thereby improving process yield, transmission reliability, and efficiency, effectively accelerating deployment schedules.

Lee Jung-chang, General Manager of Wha Yu Industrial Co., Ltd., stated that automated production capacity, combined with NewPhotonics' highly integrated microcontroller designed for rapid and reliable mass production, will be able to fill the supply gap brought by the AI wave and ensure the supply of next-generation connection solutions. (Editor: Yang Kai-hsiang) 1150506

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