TSMC Senior VP: Ready for Any New Business Opportunities, Considering Further US Investment?
TSMC Senior Vice President Hou Yung-Ching stated at the "SelectUSA Investment Summit" that the company is prepared for any new business growth opportunities. TSMC has announced an expanded investment of $165 billion in the US to build multiple wafer fabs and R&D centers in Arizona, with 3nm process mass production expected by late 2027.
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- 📰 Published: May 6, 2026 at 11:16
- 🔍 Collected: May 6, 2026 at 11:31 (15 min after Published)
- 🤖 AI Analyzed: May 6, 2026 at 12:05 (33 min after Collected)
(Maryland, CNA Correspondent Hou Tzu-Ying, May 5) US President Donald Trump has actively promoted the return of manufacturing to the United States. TSMC has already announced an expanded factory presence in the US, with a total investment reaching $165 billion. TSMC Senior Vice President Hou Yung-Ching, when asked today at the "SelectUSA Investment Summit" whether the company would further increase its investment, responded, "We are prepared for any new business growth opportunities."
The 2026 "SelectUSA Investment Summit" is taking place from May 3rd to 6th in Maryland, near Washington D.C. Hou Yung-Ching, TSMC Senior Vice President, Co-Chief Operating Officer, and Chief Information Security Officer, along with representatives from Hanwha Defense USA and Swiss Lonza Group, served as panelists this afternoon in the "Manufacturing in America 2.0: Manufacturing Renaissance" discussion.
Regarding the moderator's question about TSMC's future plans for further investment in the US, Hou Yung-Ching replied that many possibilities exist, and "we are prepared for any new business growth opportunities." Late last year, TSMC acquired new land across from its existing Arizona facility.
TSMC, the world's largest dedicated semiconductor foundry, announced in March last year that it would invest at least another $100 billion (approximately NT$3.2915 trillion) in the US, following its initial plans to build three wafer fabs in Arizona. This additional investment will be used to construct three more wafer fabs, two advanced packaging plants, and one R&D center, bringing TSMC's total investment in the US to $165 billion.
Discussing the progress of TSMC's factory construction in Arizona, Hou Yung-Ching stated that the first phase took a significant amount of time, but with accumulated experience, the second phase is accelerating.
When asked if TSMC's decision to expand its investment in the US was related to national security considerations, Hou Yung-Ching responded that when TSMC selects locations for manufacturing base investments, it is primarily based on customer business needs. The decision to invest in new capacity in Arizona was driven by the belief that it can meet customer demands for capacity and supply chain resilience.
To meet the strong demand for artificial intelligence (AI) applications, TSMC Chairman and CEO C.C. Wei stated in April that the second Arizona plant, which has completed construction, will adopt the 3-nanometer process and is expected to begin mass production in the second half of 2027.
The 2026 "SelectUSA Investment Summit" is taking place from May 3rd to 6th in Maryland, near Washington D.C. Hou Yung-Ching, TSMC Senior Vice President, Co-Chief Operating Officer, and Chief Information Security Officer, along with representatives from Hanwha Defense USA and Swiss Lonza Group, served as panelists this afternoon in the "Manufacturing in America 2.0: Manufacturing Renaissance" discussion.
Regarding the moderator's question about TSMC's future plans for further investment in the US, Hou Yung-Ching replied that many possibilities exist, and "we are prepared for any new business growth opportunities." Late last year, TSMC acquired new land across from its existing Arizona facility.
TSMC, the world's largest dedicated semiconductor foundry, announced in March last year that it would invest at least another $100 billion (approximately NT$3.2915 trillion) in the US, following its initial plans to build three wafer fabs in Arizona. This additional investment will be used to construct three more wafer fabs, two advanced packaging plants, and one R&D center, bringing TSMC's total investment in the US to $165 billion.
Discussing the progress of TSMC's factory construction in Arizona, Hou Yung-Ching stated that the first phase took a significant amount of time, but with accumulated experience, the second phase is accelerating.
When asked if TSMC's decision to expand its investment in the US was related to national security considerations, Hou Yung-Ching responded that when TSMC selects locations for manufacturing base investments, it is primarily based on customer business needs. The decision to invest in new capacity in Arizona was driven by the belief that it can meet customer demands for capacity and supply chain resilience.
To meet the strong demand for artificial intelligence (AI) applications, TSMC Chairman and CEO C.C. Wei stated in April that the second Arizona plant, which has completed construction, will adopt the 3-nanometer process and is expected to begin mass production in the second half of 2027.