Southeast Asia Semiconductor Exhibition Opens, Unimicron Showcases AI Semiconductor Test Interfaces
Unimicron Technology is exhibiting comprehensive AI semiconductor test interface solutions at SEMICON SEA 2026 in Kuala Lumpur, Malaysia. The company has established a subsidiary in Penang to strengthen its presence in the growing Southeast Asian market and address the challenges and opportunities brought by increasing AI computing power demands.
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- 📰 Published: May 5, 2026 at 13:34
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ASEAN Finance Special Report (total 300 articles)
Central News Agency (CNA)
(CNA reporter Chung Jung-feng, Taipei, 5th) The Southeast Asia Semiconductor Exhibition (SEMICON SEA 2026) opens today in Kuala Lumpur, Malaysia. Test interface manufacturer Unimicron Technology (Unimicron) announced via press release that it is showcasing its comprehensive 'AI plus' semiconductor test interface solutions at the venue. These include superconducting test sockets, high-frequency high-speed test sockets (Coaxial Socket), silicon photonics CPO solutions, and liquid cooling solutions.
Unimicron stated that the growth trend of the Southeast Asian semiconductor market is clear and is currently in a period of rapid expansion. At the end of 2024, it established a subsidiary in Penang, not only strengthening its Southeast Asian regional business and engineering teams but also strategically deploying high-end technical services, FAE engineering team support, and high-level system testing (SLT) to serve local integrated device manufacturers (IDMs) and packaging and testing plants.
Looking ahead at the global semiconductor industry development trend, Chen Shao-kun, Executive Vice General Manager of Global Business Operations at Unimicron Technology, stated that driven by the waves of AI computing power, digitalization, and high-speed computing, the global semiconductor market output value is expected to reach US$1 trillion ahead of schedule. This also brings greater challenges to the semiconductor test interface industry, including larger package sizes, longer test times, increased power consumption, and extended advanced process times. However, these related challenges also bring business opportunities to the semiconductor test interface industry.
Unimicron explained that as the usage of AI tokens continues to increase, the semiconductor supply chain is being reshaped from the concept of hardware manufacturing to 'AI Factories,' driving the industry from a hardware arms race to focusing on production efficiency after investment. This makes advanced semiconductor processes and advanced packaging technology nodes even more critical.
In line with this trend, Unimicron stated that it is seizing the business opportunities brought by AI applications, including advanced packaging testing, CPO, and chiplets. It is strategically developing products related to large packaging, high power consumption, high-frequency high-speed advanced packaging and testing, and is also expanding into probe cards, gradually expanding production capacity. (Editor: Yang Kai-hsiang) 1150505
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Central News Agency (CNA)
(CNA reporter Chung Jung-feng, Taipei, 5th) The Southeast Asia Semiconductor Exhibition (SEMICON SEA 2026) opens today in Kuala Lumpur, Malaysia. Test interface manufacturer Unimicron Technology (Unimicron) announced via press release that it is showcasing its comprehensive 'AI plus' semiconductor test interface solutions at the venue. These include superconducting test sockets, high-frequency high-speed test sockets (Coaxial Socket), silicon photonics CPO solutions, and liquid cooling solutions.
Unimicron stated that the growth trend of the Southeast Asian semiconductor market is clear and is currently in a period of rapid expansion. At the end of 2024, it established a subsidiary in Penang, not only strengthening its Southeast Asian regional business and engineering teams but also strategically deploying high-end technical services, FAE engineering team support, and high-level system testing (SLT) to serve local integrated device manufacturers (IDMs) and packaging and testing plants.
Looking ahead at the global semiconductor industry development trend, Chen Shao-kun, Executive Vice General Manager of Global Business Operations at Unimicron Technology, stated that driven by the waves of AI computing power, digitalization, and high-speed computing, the global semiconductor market output value is expected to reach US$1 trillion ahead of schedule. This also brings greater challenges to the semiconductor test interface industry, including larger package sizes, longer test times, increased power consumption, and extended advanced process times. However, these related challenges also bring business opportunities to the semiconductor test interface industry.
Unimicron explained that as the usage of AI tokens continues to increase, the semiconductor supply chain is being reshaped from the concept of hardware manufacturing to 'AI Factories,' driving the industry from a hardware arms race to focusing on production efficiency after investment. This makes advanced semiconductor processes and advanced packaging technology nodes even more critical.
In line with this trend, Unimicron stated that it is seizing the business opportunities brought by AI applications, including advanced packaging testing, CPO, and chiplets. It is strategically developing products related to large packaging, high power consumption, high-frequency high-speed advanced packaging and testing, and is also expanding into probe cards, gradually expanding production capacity. (Editor: Yang Kai-hsiang) 1150505
Choose to stand with facts. Every sponsorship is a force to protect press freedom.
Download the CNA 'First-hand News' APP to stay updated with the latest news.
The text, images, and videos on this website may not be reproduced, publicly broadcast, or publicly transmitted and utilized without authorization.