Foxconn: AI Infrastructure Spending to Grow Double-Digit, Supporting Clients' Accelerated Deployment
Foxconn announced that its AI infrastructure expenditure is projected to grow by double-digit percentages this year, leveraging its automated manufacturing and global supply chain to assist clients in accelerating AI deployment. Chairman Liu Young-way stated the company is transforming from a traditional manufacturer into a technology manufacturing platform service provider.
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- 📰 Published: April 29, 2026 at 09:44
- 🔍 Collected: April 29, 2026 at 10:01 (17 min after Published)
- 🤖 AI Analyzed: April 29, 2026 at 10:06 (4 min after Collected)
Central News Agency
(Central News Agency reporter Zhong Rong-feng, Taipei, 29th) Foxconn will hold its shareholders' meeting on May 29. Chairman Liu Young-way stated in his report to shareholders that this year's artificial intelligence (AI) infrastructure expenditure is expected to maintain high double-digit percentage growth. Foxconn will leverage its automated manufacturing capabilities and global supply chain network to fully support global clients in accelerating AI deployment.
Liu Young-way said that major cloud service providers (CSPs) are significantly expanding their AI capital expenditures, and the industry's investment focus has clearly shifted from the terminal consumer market to cloud infrastructure centered on "computing power."
In the field of AI infrastructure, Liu Young-way pointed out that the Foxconn Technology Group provides solutions ranging from key components, module design, and liquid cooling technology to complete machine and rack integration (Server/Rack). He stated that the Foxconn Group invests more than NT$100 billion (approximately 1.5% to 2% of revenue) annually in research and development, focusing on AI high-efficiency heat dissipation, smart manufacturing automation, and key modules for electric vehicles.
Regarding the impact of tariffs and geopolitics, Liu Young-way noted that these are no longer short-term cost variables but long-term drivers for supply chain restructuring. Foxconn is transforming from a traditional manufacturing OEM into a "technology manufacturing platform service company" through its global manufacturing footprint and BOL (Build Operate Localize) regional operating model. This involves flexible cross-regional production capacity allocation and deepening local procurement to mitigate the risks of tariff policy changes in a single country.
For critical raw materials such as semiconductor chips, high-speed connectors, and precision mechanical components, Liu Young-way stated that the Foxconn Technology Group continues to strengthen supply chain resilience and rigorously control relevant risks through strategic cooperation and diversified supply source arrangements.
Facing exchange rate fluctuations and uncertainties in the global political and economic environment, Liu Young-way said that the Foxconn Technology Group continues to strengthen financial hedging mechanisms and production capacity allocation to enhance overall operational resilience, ensuring that it can maintain operational efficiency and stable profitability in different market scenarios. (Editor: Zhang Jun-mao) 1150429
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(Central News Agency reporter Zhong Rong-feng, Taipei, 29th) Foxconn will hold its shareholders' meeting on May 29. Chairman Liu Young-way stated in his report to shareholders that this year's artificial intelligence (AI) infrastructure expenditure is expected to maintain high double-digit percentage growth. Foxconn will leverage its automated manufacturing capabilities and global supply chain network to fully support global clients in accelerating AI deployment.
Liu Young-way said that major cloud service providers (CSPs) are significantly expanding their AI capital expenditures, and the industry's investment focus has clearly shifted from the terminal consumer market to cloud infrastructure centered on "computing power."
In the field of AI infrastructure, Liu Young-way pointed out that the Foxconn Technology Group provides solutions ranging from key components, module design, and liquid cooling technology to complete machine and rack integration (Server/Rack). He stated that the Foxconn Group invests more than NT$100 billion (approximately 1.5% to 2% of revenue) annually in research and development, focusing on AI high-efficiency heat dissipation, smart manufacturing automation, and key modules for electric vehicles.
Regarding the impact of tariffs and geopolitics, Liu Young-way noted that these are no longer short-term cost variables but long-term drivers for supply chain restructuring. Foxconn is transforming from a traditional manufacturing OEM into a "technology manufacturing platform service company" through its global manufacturing footprint and BOL (Build Operate Localize) regional operating model. This involves flexible cross-regional production capacity allocation and deepening local procurement to mitigate the risks of tariff policy changes in a single country.
For critical raw materials such as semiconductor chips, high-speed connectors, and precision mechanical components, Liu Young-way stated that the Foxconn Technology Group continues to strengthen supply chain resilience and rigorously control relevant risks through strategic cooperation and diversified supply source arrangements.
Facing exchange rate fluctuations and uncertainties in the global political and economic environment, Liu Young-way said that the Foxconn Technology Group continues to strengthen financial hedging mechanisms and production capacity allocation to enhance overall operational resilience, ensuring that it can maintain operational efficiency and stable profitability in different market scenarios. (Editor: Zhang Jun-mao) 1150429
Stand with facts, every sponsorship you make is a force to protect press freedom.
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The text, images, and videos on this website may not be reproduced, broadcast, transmitted, or used without authorization.