TSMC to Mass Produce 2nm in 5 Fabs Simultaneously, 3-Year Capacity CAGR to Reach 70%

(Central News Agency reporter Chang Chien-chung, Hsinchu 28th) Wafer foundry leader TSMC is aggressively pushing advanced processes. This year, 5 2nm fabs will simultaneously enter mass production, and the 2nm capacity compound annual growth rate is estimated to reach 70% from 2026 to 2028.

TSMC's 2nm process will enter mass production in the fourth quarter of 2025. Senior Vice President and Co-Chief Operating Officer Hou Yung-ching stated at a recent North America Technology Forum that in response to strong demand from artificial intelligence (AI) and other applications, 5 2nm fabs will simultaneously enter mass production this year: 2 in Hsinchu and 3 in Kaohsiung.

Hou Yung-ching pointed out that the first year's wafer output for 2nm will increase by 45% compared to the first year's 3nm wafer output in 2023; the 2nm capacity compound annual growth rate will reach 70% from 2026 to 2028.

TSMC will continue to expand 3nm capacity, with the 3nm capacity compound annual growth rate expected to be around 25% from 2022 to 2027.

In addition, TSMC is actively expanding its advanced packaging capacity, with CoWoS capacity compound annual growth rate exceeding 80% and SoIC capacity compound annual growth rate exceeding 90% from 2022 to 2027.

As for its US and Japan fabs, TSMC's first fab in Arizona will see an 80% increase in output in 2026 compared to 2025, and its first fab in Kumamoto will see a 1.3-fold increase in output in 2026 compared to 2025. (Edited by Chang Chun-mao) 1150428