TSMC to Mass Produce 2nm in 5 Fabs Simultaneously, 3-Year Capacity CAGR to Reach 70%
TSMC is set to begin mass production of 2nm chips in 5 fabs this year, with a projected 70% compound annual growth rate for 2nm capacity from 2026-2028, driven by strong AI demand. The company also plans significant expansions in 3nm and advanced packaging.
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- 📰 Published: April 28, 2026 at 11:17
- 🔍 Collected: April 28, 2026 at 11:31 (14 min after Published)
- 🤖 AI Analyzed: April 28, 2026 at 12:24 (52 min after Collected)
(Central News Agency reporter Chang Chien-chung, Hsinchu 28th) Wafer foundry leader TSMC is aggressively pushing advanced processes. This year, 5 2nm fabs will simultaneously enter mass production, and the 2nm capacity compound annual growth rate is estimated to reach 70% from 2026 to 2028.
TSMC's 2nm process will enter mass production in the fourth quarter of 2025. Senior Vice President and Co-Chief Operating Officer Hou Yung-ching stated at a recent North America Technology Forum that in response to strong demand from artificial intelligence (AI) and other applications, 5 2nm fabs will simultaneously enter mass production this year: 2 in Hsinchu and 3 in Kaohsiung.
Hou Yung-ching pointed out that the first year's wafer output for 2nm will increase by 45% compared to the first year's 3nm wafer output in 2023; the 2nm capacity compound annual growth rate will reach 70% from 2026 to 2028.
TSMC will continue to expand 3nm capacity, with the 3nm capacity compound annual growth rate expected to be around 25% from 2022 to 2027.
In addition, TSMC is actively expanding its advanced packaging capacity, with CoWoS capacity compound annual growth rate exceeding 80% and SoIC capacity compound annual growth rate exceeding 90% from 2022 to 2027.
As for its US and Japan fabs, TSMC's first fab in Arizona will see an 80% increase in output in 2026 compared to 2025, and its first fab in Kumamoto will see a 1.3-fold increase in output in 2026 compared to 2025. (Edited by Chang Chun-mao) 1150428
TSMC's 2nm process will enter mass production in the fourth quarter of 2025. Senior Vice President and Co-Chief Operating Officer Hou Yung-ching stated at a recent North America Technology Forum that in response to strong demand from artificial intelligence (AI) and other applications, 5 2nm fabs will simultaneously enter mass production this year: 2 in Hsinchu and 3 in Kaohsiung.
Hou Yung-ching pointed out that the first year's wafer output for 2nm will increase by 45% compared to the first year's 3nm wafer output in 2023; the 2nm capacity compound annual growth rate will reach 70% from 2026 to 2028.
TSMC will continue to expand 3nm capacity, with the 3nm capacity compound annual growth rate expected to be around 25% from 2022 to 2027.
In addition, TSMC is actively expanding its advanced packaging capacity, with CoWoS capacity compound annual growth rate exceeding 80% and SoIC capacity compound annual growth rate exceeding 90% from 2022 to 2027.
As for its US and Japan fabs, TSMC's first fab in Arizona will see an 80% increase in output in 2026 compared to 2025, and its first fab in Kumamoto will see a 1.3-fold increase in output in 2026 compared to 2025. (Edited by Chang Chun-mao) 1150428