Powertech: Expects Quarterly Growth This Year, CAPEX Raised to 50 Billion NTD
Semiconductor packaging and testing major Powertech Technology Inc. (PTI) expects quarterly growth throughout 2026, driven by strong AI demand. The company raised its CAPEX to 50 billion NTD from 40 billion NTD.
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- 📰 Published: April 28, 2026 at 18:05
- 🔍 Collected: April 28, 2026 at 18:32 (26 min after Published)
- 🤖 AI Analyzed: April 28, 2026 at 20:13 (1h 40m after Collected)
(Taipei, April 28, CNA) Semiconductor OSAT (Outsourced Semiconductor Assembly and Test) provider Powertech Technology Inc. (PTI) predicted today that market supply and demand would remain stable in the second quarter. The company hopes for quarterly growth throughout the year, targeting high single-digit growth for the full year and striving for double-digit growth. Powertech also upwardly revised its 2026 capital expenditure (CAPEX) from the previously planned 40 billion NTD to 50 billion NTD.
PTI Chairman Tsai Tu-kung stated that the group prioritizes investing in Taiwan while continuing to plan for layouts in Southeast Asia (Singapore) and Northeast Asia (Japan). Further announcements will be made as news develops.
At an institutional investor conference this afternoon, PTI CEO Hsieh Yung-ta noted that the memory market maintains strong momentum. Driven by AI applications, demand for High Bandwidth Memory (HBM) continues to be robust. The expansion of AI applications is also driving demand for large chips and advanced packaging, with the OSAT industry benefiting from high-end applications.
In the DRAM sector, Hsieh stated that the industry is focusing on High-Performance Computing (HPC) and AI server-related applications, driving strong demand for DRAM packaging and pushing up quotes. The second quarter will see inventory preparation for new smartphones and consumer products, which is expected to contribute to revenue. PTI is actively enhancing its technology and mass production capabilities for HBM as the market expands.
Regarding NAND Flash and SSDs, Hsieh pointed out continued benefits from AI expansion and new smartphone preparations. Demand for SSD and NAND packaging and testing is expected to continue growing in Q2. PTI mentioned that in response to rising material and gold wire costs, it is gradually reflecting these costs in its NAND and SSD packaging prices, which is expected to support revenue and gross margins.
In the logic chip segment, demand for high-end FCBGA packaging continues to grow, and new products are entering mass production. Capacity utilization remains high, significantly contributing to the gross margin of the logic packaging business. PTI highlighted its capability to mass-produce large-size FCBGA multi-chip modules (MCM) for next-gen AI and HPC applications, citing its strengths in high-precision mounting, thermal management, and yield rates.
Regarding advanced Fan-Out Panel-Level Packaging (FOPLP), PTI noted it is deepening cooperation with customers and accelerating sample validation, with mass production scheduled for 2027.
PTI's Q1 consolidated revenue was 21.314 billion NTD, a 0.4% decrease from the previous quarter but a 37.6% increase year-over-year. Q1 gross margin was 19.4%, up 0.8 percentage points from Q4 and 2.3 percentage points from last year. Net profit attributable to the parent company was 1.844 billion NTD, and earnings per share (EPS) were 2.5 NTD.
PTI Chairman Tsai Tu-kung stated that the group prioritizes investing in Taiwan while continuing to plan for layouts in Southeast Asia (Singapore) and Northeast Asia (Japan). Further announcements will be made as news develops.
At an institutional investor conference this afternoon, PTI CEO Hsieh Yung-ta noted that the memory market maintains strong momentum. Driven by AI applications, demand for High Bandwidth Memory (HBM) continues to be robust. The expansion of AI applications is also driving demand for large chips and advanced packaging, with the OSAT industry benefiting from high-end applications.
In the DRAM sector, Hsieh stated that the industry is focusing on High-Performance Computing (HPC) and AI server-related applications, driving strong demand for DRAM packaging and pushing up quotes. The second quarter will see inventory preparation for new smartphones and consumer products, which is expected to contribute to revenue. PTI is actively enhancing its technology and mass production capabilities for HBM as the market expands.
Regarding NAND Flash and SSDs, Hsieh pointed out continued benefits from AI expansion and new smartphone preparations. Demand for SSD and NAND packaging and testing is expected to continue growing in Q2. PTI mentioned that in response to rising material and gold wire costs, it is gradually reflecting these costs in its NAND and SSD packaging prices, which is expected to support revenue and gross margins.
In the logic chip segment, demand for high-end FCBGA packaging continues to grow, and new products are entering mass production. Capacity utilization remains high, significantly contributing to the gross margin of the logic packaging business. PTI highlighted its capability to mass-produce large-size FCBGA multi-chip modules (MCM) for next-gen AI and HPC applications, citing its strengths in high-precision mounting, thermal management, and yield rates.
Regarding advanced Fan-Out Panel-Level Packaging (FOPLP), PTI noted it is deepening cooperation with customers and accelerating sample validation, with mass production scheduled for 2027.
PTI's Q1 consolidated revenue was 21.314 billion NTD, a 0.4% decrease from the previous quarter but a 37.6% increase year-over-year. Q1 gross margin was 19.4%, up 0.8 percentage points from Q4 and 2.3 percentage points from last year. Net profit attributable to the parent company was 1.844 billion NTD, and earnings per share (EPS) were 2.5 NTD.