Makalot unveils inspection equipment targeting semiconductors, high-end PCBs
Makalot Industrial Co., Ltd. announced new inspection equipment for semiconductors and high-end PCBs, responding to the increasing demand driven by AI and high-performance computing. This move strengthens its dual-track strategy in both PCB AOI and electrical testing equipment markets, and expands into the semiconductor inspection equipment sector.
📋 Article Processing Timeline
- 📰 Published: April 22, 2026 at 20:20
- 🔍 Collected: April 22, 2026 at 20:32 (11 min after Published)
- 🤖 AI Analyzed: April 22, 2026 at 21:09 (36 min after Collected)
Central News Agency
(Central News Agency reporter Chiang Ming-An, Taipei, 22nd) With the development of AI, high-performance computing, and advanced packaging applications, the demand for high-end PCB and semiconductor manufacturing process inspection continues to rise. Optical inspection equipment manufacturer Makalot Industrial Co., Ltd. announced that it will unveil new semiconductor and high-end PCB inspection equipment products, deepening the results of its dual-track layout in PCB and semiconductor.
Automatic AOI (Automated Optical Inspection) equipment manufacturer Makalot Industrial Co., Ltd. will hold a new product launch event in Kunshan on the 23rd, simultaneously introducing new semiconductor and high-end PCB (Printed Circuit Board) inspection equipment products, including PCB HDI (High-Density Interconnect) and CSP (Chip Scale Package) four-wire electrical testing machines, in-line mSAP (modified semi-additive process)/substrate fine line and micro blind hole AOI, and semiconductor FOUP (Front Opening Unified Pod) AOI equipment.
Makalot stated that the unveiled four-wire electrical testing machines primarily target the high-end HDI and CSP application markets. In response to the demand driven by AI servers and high-performance computing (HPC), high-end PCBs are moving towards fine lines and high density, simultaneously increasing the requirements for electrical testing precision and efficiency. The new generation equipment can help customers improve testing efficiency, reduce manufacturing process risks, and enhance mass production yield.
Regarding AOI products, Makalot stated that it is simultaneously launching in-line mSAP and substrate fine line, micro blind hole inspection AOI equipment, in response to the demand for improved precision in advanced substrate and high-end PCB manufacturing processes. With the trend towards high-layer count, high-density, and miniaturized manufacturing processes, traditional inspection methods are increasingly unable to meet demand. The new generation AOI equipment can improve defect detection capabilities and strengthen automated production processes.
In addition, Makalot also unveiled semiconductor FOUP AOI inspection equipment. With the increasing demand for advanced semiconductor manufacturing processes and automated handling, related inspection demands continue to rise. This product has been planned for introduction into customer verification processes, expanding into the semiconductor inspection equipment market.
Makalot pointed out that in line with the first wave of new product launch plans mentioned at previous investor conferences for the first half of the year, through simultaneous upgrades of electrical testing and AOI equipment and extension to semiconductor applications, it continues to promote the "dual-track, four-line" development strategy, deepening the PCB AOI and electrical testing equipment markets, while actively deploying in the semiconductor inspection equipment field. (Edited by Yang Kai-Hsiang) 1150422
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(Central News Agency reporter Chiang Ming-An, Taipei, 22nd) With the development of AI, high-performance computing, and advanced packaging applications, the demand for high-end PCB and semiconductor manufacturing process inspection continues to rise. Optical inspection equipment manufacturer Makalot Industrial Co., Ltd. announced that it will unveil new semiconductor and high-end PCB inspection equipment products, deepening the results of its dual-track layout in PCB and semiconductor.
Automatic AOI (Automated Optical Inspection) equipment manufacturer Makalot Industrial Co., Ltd. will hold a new product launch event in Kunshan on the 23rd, simultaneously introducing new semiconductor and high-end PCB (Printed Circuit Board) inspection equipment products, including PCB HDI (High-Density Interconnect) and CSP (Chip Scale Package) four-wire electrical testing machines, in-line mSAP (modified semi-additive process)/substrate fine line and micro blind hole AOI, and semiconductor FOUP (Front Opening Unified Pod) AOI equipment.
Makalot stated that the unveiled four-wire electrical testing machines primarily target the high-end HDI and CSP application markets. In response to the demand driven by AI servers and high-performance computing (HPC), high-end PCBs are moving towards fine lines and high density, simultaneously increasing the requirements for electrical testing precision and efficiency. The new generation equipment can help customers improve testing efficiency, reduce manufacturing process risks, and enhance mass production yield.
Regarding AOI products, Makalot stated that it is simultaneously launching in-line mSAP and substrate fine line, micro blind hole inspection AOI equipment, in response to the demand for improved precision in advanced substrate and high-end PCB manufacturing processes. With the trend towards high-layer count, high-density, and miniaturized manufacturing processes, traditional inspection methods are increasingly unable to meet demand. The new generation AOI equipment can improve defect detection capabilities and strengthen automated production processes.
In addition, Makalot also unveiled semiconductor FOUP AOI inspection equipment. With the increasing demand for advanced semiconductor manufacturing processes and automated handling, related inspection demands continue to rise. This product has been planned for introduction into customer verification processes, expanding into the semiconductor inspection equipment market.
Makalot pointed out that in line with the first wave of new product launch plans mentioned at previous investor conferences for the first half of the year, through simultaneous upgrades of electrical testing and AOI equipment and extension to semiconductor applications, it continues to promote the "dual-track, four-line" development strategy, deepening the PCB AOI and electrical testing equipment markets, while actively deploying in the semiconductor inspection equipment field. (Edited by Yang Kai-Hsiang) 1150422
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