VIA Technologies Unveils AI Dual-Monitoring Telescopic EV Charging Pile at Taipei AMPA

VIA Technologies (VIA) announced today at the 2026 Taipei AMPA show that it has collaborated with Ajin and HanYu to display a dual-monitoring safety telescopic EV charging pile, providing a comprehensive smart protection solution for electric vehicle charging. The intelligent design integrates VIA's RGB and IR thermal imaging dual-monitoring system, which can monitor the connection status between the charging gun and the socket in real-time, as well as potential temperature anomalies. It also monitors the battery temperature at the bottom of the EV to detect overheating early, reducing the risk of thermal runaway. All monitoring data is analyzed in real-time using VIA's edge AI computing technology. Furthermore, the telescopic design allows flexible adjustment of the cable length, and an integrated smart information panel can serve as a platform for advertisements and public information.