TSMC: Deploying CoPoS advanced packaging manufacturing, mass production schedule expected
TSMC CEO C.C. Wei announced the development of the CoPoS advanced packaging manufacturing process, expecting mass production in a few years to meet tight capacity and soaring AI demand, while expanding CoWoS and partnering with OSATs.
📋 Article Processing Timeline
- 📰 Published: April 16, 2026 at 16:24
- 🔍 Collected: April 16, 2026 at 16:31 (7 min after Published)
- 🤖 AI Analyzed: April 19, 2026 at 00:45 (56h 13m after Collected)
Central News Agency
(Central News Agency reporter Zhong Rongfeng, Taipei, 16th) TSMC Chairman and CEO C.C. Wei stated at an online institutional investors' conference this afternoon that TSMC is deploying the CoPoS advanced packaging manufacturing process, estimating it could enter the mass production stage in a few years. He pointed out that current packaging capacity supply remains tight; TSMC is expanding its own capacity on one hand, while continuing to work closely with Outsourced Semiconductor Assembly and Test (OSAT) companies on the other.
When asked by institutional investors about the progress of TSMC's advanced packaging layout, Wei noted that TSMC is continually expanding its CoWoS advanced packaging capacity. CoWoS volume continues to grow, and TSMC will ensure CoWoS capacity supply to support customer needs with a reasonable cost structure.
Wei also revealed that TSMC is establishing the manufacturing process for CoPoS (Chip on Panel on Substrate) advanced packaging technology, expecting CoPoS to have the opportunity to enter the mass production stage in a few years.
Wei stated that TSMC provides the largest advanced packaging capacity in the industry currently. Competitors indeed possess technologies that attract the market, and TSMC welcomes relevant developments, as this may give customers more choices. Through this, TSMC can develop more cooperation opportunities with customers, and TSMC will not give up any business opportunities.
Wei mentioned that TSMC is going all out to address all customers' demands for advanced packaging. TSMC is also developing entirely new scales of packaging technologies and continues to collaborate with all customers.
When investors asked about the partnership between TSMC and OSAT companies, Wei said that currently, overall packaging capacity supply remains tight, and TSMC continues to collaborate closely with OSATs to support strong customer demand.
Wei expressed that TSMC hopes to continually increase packaging capacity to meet customer needs, but currently, packaging supply remains tight. He also admitted frankly that in advanced packaging technologies, TSMC's engineers will still face various thorny challenges; however, he said this is a good challenge—the harder, the better. TSMC's relevant teams will solve these issues, and technology and capacity development will continue to move forward.
According to TSMC's annual report, TSMC continues to develop advanced packaging and 3D chip stacking technologies, including CoWoS, Integrated Fan-Out (InFO), 3D System Integration Chip (TSMC-SoIC), and Silicon Photonics. (Editor: Zhang Liangzhi) 1150416
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(Central News Agency reporter Zhong Rongfeng, Taipei, 16th) TSMC Chairman and CEO C.C. Wei stated at an online institutional investors' conference this afternoon that TSMC is deploying the CoPoS advanced packaging manufacturing process, estimating it could enter the mass production stage in a few years. He pointed out that current packaging capacity supply remains tight; TSMC is expanding its own capacity on one hand, while continuing to work closely with Outsourced Semiconductor Assembly and Test (OSAT) companies on the other.
When asked by institutional investors about the progress of TSMC's advanced packaging layout, Wei noted that TSMC is continually expanding its CoWoS advanced packaging capacity. CoWoS volume continues to grow, and TSMC will ensure CoWoS capacity supply to support customer needs with a reasonable cost structure.
Wei also revealed that TSMC is establishing the manufacturing process for CoPoS (Chip on Panel on Substrate) advanced packaging technology, expecting CoPoS to have the opportunity to enter the mass production stage in a few years.
Wei stated that TSMC provides the largest advanced packaging capacity in the industry currently. Competitors indeed possess technologies that attract the market, and TSMC welcomes relevant developments, as this may give customers more choices. Through this, TSMC can develop more cooperation opportunities with customers, and TSMC will not give up any business opportunities.
Wei mentioned that TSMC is going all out to address all customers' demands for advanced packaging. TSMC is also developing entirely new scales of packaging technologies and continues to collaborate with all customers.
When investors asked about the partnership between TSMC and OSAT companies, Wei said that currently, overall packaging capacity supply remains tight, and TSMC continues to collaborate closely with OSATs to support strong customer demand.
Wei expressed that TSMC hopes to continually increase packaging capacity to meet customer needs, but currently, packaging supply remains tight. He also admitted frankly that in advanced packaging technologies, TSMC's engineers will still face various thorny challenges; however, he said this is a good challenge—the harder, the better. TSMC's relevant teams will solve these issues, and technology and capacity development will continue to move forward.
According to TSMC's annual report, TSMC continues to develop advanced packaging and 3D chip stacking technologies, including CoWoS, Integrated Fan-Out (InFO), 3D System Integration Chip (TSMC-SoIC), and Silicon Photonics. (Editor: Zhang Liangzhi) 1150416
Choose to stand with facts, every sponsorship from you is the power to guard press freedom
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The text, images, audio, and video on this website may not be reproduced, publicly broadcast, publicly transmitted, or utilized without authorization.