Hsinchu, April 17 (CNA) -- Song Sheng, a supplier of semiconductor polishing pads and consumables, is expected to list on May 7th. The tentative underwriting price is NT$258 per share, with competitive bidding scheduled from April 21st to 23rd, starting at a floor price of NT$215 per share. The bidding results will be announced on April 27th.

Song Sheng originated from the traditional polyurethane (PU) materials industry and gradually transitioned into the medical device and semiconductor sectors. Currently, semiconductor polishing pads and consumables are its main products, accounting for over 60% of its revenue.

Song Sheng's revenue in 2025 was NT$1.981 billion, an increase of 3.07% year-on-year. Net profit attributable to the parent company was NT$191 million, with earnings per share of NT$3.24. In the first quarter of 2026, revenue reached NT$559 million, a year-on-year increase of 16.63%.

Song Sheng's operating outlook for this year is optimistic, and it anticipates further performance growth next year with the commencement of new production lines. The company currently holds about a 4% market share in semiconductor polishing pads and aims to challenge for a 10% market share. (Editor: Zhang Liang-zhi) 1150417

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  • Source: CNA (Central News Agency)
  • Category: Funding