Applied Materials and JSR Open Planarization Center; TSMC: Unleashing More Creativity
JSR Micro Taiwan and Applied Materials Taiwan have jointly opened the Advanced Planarization Process Solutions Joint Research Center in Hsinchu. TSMC expects this collaboration to overcome 1nm process challenges and accelerate global AI development.
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- 📰 Published: April 15, 2026 at 13:36
- 🔍 Collected: April 15, 2026 at 14:01 (25 min after Published)
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Central News Agency reporter Chang Chien-chung reporting from Hsinchu on the 15th. The Advanced Planarization Process Solutions Joint Research Center, jointly established by JSR Micro Taiwan (a subsidiary of Japanese company JSR) and Applied Materials Taiwan, was inaugurated today. TSMC Research and Development Vice President Chang Hsun-ming stated that this is like providing a new, more advanced, and complete kitchen, allowing for more creativity and creating more impossibilities.
The Advanced Planarization Process Solutions Joint Research Center is located in Hukou Township, Hsinchu County. Toru Kimura, General Manager of JSR Electronic Materials Division; Erix Yu, Group Vice President and President of Applied Materials Taiwan; and Chang Hsun-ming all attended today's inauguration ceremony.
During his speech, Chang Hsun-ming mentioned that when he joined TSMC over 30 years ago, he was the first Chemical Mechanical Planarization (CMP) engineer. Back then, they polished 6-inch wafers, and with the evolution of semiconductor generations, they are now polishing 12-inch wafers.
He noted that CMP suppliers have evolved from a crowded field to just a few outstanding competitors who have survived long-term competition. Chang stated that Applied Materials and JSR are among the most exceptional suppliers.
Chang pointed out that from the 0.13-micron era in the 90s to today's 1-nanometer node, Applied Materials has always been a crucial equipment supplier for TSMC's CMP, constantly supporting the advancement of TSMC's CMP technology with highly advanced tech.
During the development of CMP technology, TSMC and JSR have collaborated closely early on, jointly developing new slurries. Chang recalled that a breakthrough in copper process slurry earned him and his team TSMC's first Innovation and Reform Award in 2005, remembering the substantial prize money.
Chang expressed that for TSMC, Applied Materials' equipment and JSR's slurries are like kitchenware and ingredients. TSMC is like a master chef who must perfectly coordinate all three to create Michelin-star-level cuisine.
Chang said that the inauguration of the research center today is like providing a new, more advanced, and complete kitchen, where more creativity can be unleashed to create the impossible.
He also stated that in the AI era, the demand for advanced chips is growing, and CMP challenges are increasing. The required flatness after polishing a 12-inch wafer must be within 1 nanometer—equivalent to the surface unevenness of a baseball field being less than the thickness of a single hair. This immense engineering challenge is the requirement for advanced processes.
Looking ahead, Chang emphasized that TSMC's collaboration with Applied Materials and JSR in equipment, slurries, and materials will become even closer. This not only demonstrates the importance of cross-border and cross-company collaboration but also bears witness to the trend of major international companies developing semiconductor technology in Taiwan, as well as TSMC's determination to keep its roots in Taiwan. He hopes to soon see the center's research applied to TSMC's advanced chips, making phones and computers perform better and accelerating global AI development.
Erix Yu commented that today marks a highly significant milestone, an opportunity of right timing, right place, and right people. The collaborative model established by the three parties is just the beginning, and he looks forward to more excellent results.
The Advanced Planarization Process Solutions Joint Research Center is located in Hukou Township, Hsinchu County. Toru Kimura, General Manager of JSR Electronic Materials Division; Erix Yu, Group Vice President and President of Applied Materials Taiwan; and Chang Hsun-ming all attended today's inauguration ceremony.
During his speech, Chang Hsun-ming mentioned that when he joined TSMC over 30 years ago, he was the first Chemical Mechanical Planarization (CMP) engineer. Back then, they polished 6-inch wafers, and with the evolution of semiconductor generations, they are now polishing 12-inch wafers.
He noted that CMP suppliers have evolved from a crowded field to just a few outstanding competitors who have survived long-term competition. Chang stated that Applied Materials and JSR are among the most exceptional suppliers.
Chang pointed out that from the 0.13-micron era in the 90s to today's 1-nanometer node, Applied Materials has always been a crucial equipment supplier for TSMC's CMP, constantly supporting the advancement of TSMC's CMP technology with highly advanced tech.
During the development of CMP technology, TSMC and JSR have collaborated closely early on, jointly developing new slurries. Chang recalled that a breakthrough in copper process slurry earned him and his team TSMC's first Innovation and Reform Award in 2005, remembering the substantial prize money.
Chang expressed that for TSMC, Applied Materials' equipment and JSR's slurries are like kitchenware and ingredients. TSMC is like a master chef who must perfectly coordinate all three to create Michelin-star-level cuisine.
Chang said that the inauguration of the research center today is like providing a new, more advanced, and complete kitchen, where more creativity can be unleashed to create the impossible.
He also stated that in the AI era, the demand for advanced chips is growing, and CMP challenges are increasing. The required flatness after polishing a 12-inch wafer must be within 1 nanometer—equivalent to the surface unevenness of a baseball field being less than the thickness of a single hair. This immense engineering challenge is the requirement for advanced processes.
Looking ahead, Chang emphasized that TSMC's collaboration with Applied Materials and JSR in equipment, slurries, and materials will become even closer. This not only demonstrates the importance of cross-border and cross-company collaboration but also bears witness to the trend of major international companies developing semiconductor technology in Taiwan, as well as TSMC's determination to keep its roots in Taiwan. He hopes to soon see the center's research applied to TSMC's advanced chips, making phones and computers perform better and accelerating global AI development.
Erix Yu commented that today marks a highly significant milestone, an opportunity of right timing, right place, and right people. The collaborative model established by the three parties is just the beginning, and he looks forward to more excellent results.