HIWIN's March Revenue Hits Record High; Group Focuses on Panel-Level Packaging Positioning Platform
HIWIN and its affiliate PMI Group are exhibiting at the 2026 Electronic Production Manufacturing Equipment Exhibition, showcasing new nano-scale and multi-dimensional positioning platforms for panel-level packaging inspection and semiconductor wafer processes, anticipating growth driven by AI and semiconductor applications.
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- 📰 Published: April 8, 2026 at 16:19
- 🔍 Collected: April 8, 2026 at 17:00 (41 min after Published)
- 🤖 AI Analyzed: April 20, 2026 at 12:15 (283h 15m after Collected)
The 2026 Electronic Production Manufacturing Equipment Exhibition is opening today. HIWIN and its affiliate, PMI Group, are exhibiting. PMI Group is showcasing a new nano-scale positioning stage (Nano-scale Positioning Stage).
According to a press release from PMI Group, the nano-scale positioning stage, combined with HIWIN's automated subsystems, can be applied to high-end optical inspection equipment for panel-level packaging (PLP) capacity, meeting the inspection demands of larger panel sizes.
Regarding the focusing difficulties caused by wafer warpage in semiconductor products, PMI Group stated that they are also launching a multi-dimensional positioning platform at this exhibition. This platform has four degrees of freedom for positioning and can instantly correct posture changes of different workpieces during inspection, effectively solving focusing issues and improving the yield rates for wafer mass inspection, laser cutting, and other processes.
Looking ahead to this year's growth drivers, HIWIN previously stated that the group remains optimistic about demand from semiconductor, artificial intelligence (AI) automation, and robotics applications. The situation for some non-standard products is recovering. They anticipate continued growth in revenue and profit targets for this year, with operations in the second quarter expected to be better than the first quarter and also better than the same period in 2025. (Editor: Huang Guolun) 1150408
According to a press release from PMI Group, the nano-scale positioning stage, combined with HIWIN's automated subsystems, can be applied to high-end optical inspection equipment for panel-level packaging (PLP) capacity, meeting the inspection demands of larger panel sizes.
Regarding the focusing difficulties caused by wafer warpage in semiconductor products, PMI Group stated that they are also launching a multi-dimensional positioning platform at this exhibition. This platform has four degrees of freedom for positioning and can instantly correct posture changes of different workpieces during inspection, effectively solving focusing issues and improving the yield rates for wafer mass inspection, laser cutting, and other processes.
Looking ahead to this year's growth drivers, HIWIN previously stated that the group remains optimistic about demand from semiconductor, artificial intelligence (AI) automation, and robotics applications. The situation for some non-standard products is recovering. They anticipate continued growth in revenue and profit targets for this year, with operations in the second quarter expected to be better than the first quarter and also better than the same period in 2025. (Editor: Huang Guolun) 1150408