Amkor and TSMC Sign 10-Year Agreement to Strengthen Advanced Semiconductor Packaging in the U.S.

(Taipei, June 17, CNA) Amkor Technology, a semiconductor packaging and testing company, announced on June 16 (U.S. time) that it has signed a 10-year cooperation agreement with TSMC to establish a close partnership aimed at enhancing advanced semiconductor packaging capabilities in Arizona, USA, and accelerating investment and development within the U.S. semiconductor supply chain ecosystem.

Amkor stated that under the agreement, both parties will establish a collaborative framework, with TSMC procuring advanced packaging and testing services from Amkor.

Dr. Chuang Chia-chiang, Senior Vice President of Worldwide Business and Co-Chief Operating Officer at TSMC, said that TSMC has a long-standing collaboration with Amkor in the field of advanced packaging globally, and is confident that their joint efforts in the U.S. will succeed, further enhancing their ability to serve customers together.

Kevin Engel, CEO of Amkor, noted that this agreement marks a significant milestone in Amkor’s partnership with TSMC, accelerating Amkor’s push for advanced semiconductor manufacturing in the United States.

Earlier media reports indicated that Amkor has acquired approximately 27 hectares of additional land in Arizona, adjacent to an existing 42-hectare site, where it is developing a new manufacturing campus scheduled to begin production in 2028. Amkor previously disclosed plans to collaborate with NVIDIA and Apple at its Arizona facility, as well as with AMD. In October 2024, TSMC announced deeper collaboration with Amkor to expand InFO and CoWoS advanced packaging technologies in Arizona, USA. (Editor: Yang Lan-hsuan) 1150617