Lingjia Technology to List on Emerging Stock Market on June 15; EPS for First Four Months at NT$0.51

(Central News Agency, Taipei, June 11) Semiconductor equipment maker Lingjia Technology is expected to list on the Emerging Stock Market on June 15 at a reference price of NT$130 per share. For the first four months of this year, cumulative revenue reached NT$314 million, net profit after tax was NT$42.31 million, and earnings per share (EPS) was NT$0.51.

Lingjia Technology held a pre-listing institutional investor conference today. The company stated that its core products are vacuum sputtering and plasma etching equipment, serving a customer base that includes integrated device manufacturers (IDMs) and packaging and testing houses.

The company explained that its anti-electromagnetic interference (EMI) shielding vacuum sputtering process is primarily used to form a metal shielding layer on the outside of chips after packaging. This reduces electromagnetic wave interference between chips and within modules, enhancing signal integrity and system reliability of electronic products. End applications span smartphones, wearable devices, 5G infrastructure, and low-earth orbit satellite ground communication devices.

Lingjia Technology's revenue and profit both declined last year. Revenue was NT$956 million, down 12.4% year-over-year; net profit after tax was NT$160 million, down 51.7%; and EPS was NT$1.94. For the first four months of this year, cumulative revenue was NT$314 million, net profit after tax was NT$42.31 million, and EPS was NT$0.51.

The company noted that its fan-out panel-level packaging (FOPLP) equipment has obtained certification from an international satellite manufacturer and completed initial customer deliveries in the first half of the year. Advanced substrate equipment, covering seed layer sputtering, plasma etching, and automated integration equipment, is expected to be a new growth driver for future operations.