ASE's May Revenue Hits Record High, Boosted by AI Advanced Packaging
Major semiconductor packaging and testing firm ASE Technology Holding announced on June 9th that its May consolidated revenue reached NT$63.033 billion, a 28.6% year-over-year increase and a record high for the period. Strong demand for its advanced packaging (LEAP) business, driven by AI, led the company to raise its forecast for the segment to US$3.5 billion this year. Additionally, ASE is developing an automated Panel-Level Packaging line to meet future demand from AI accelerators and HPC, with mass production planned for the first half of 2027.
📋 Article Processing Timeline
- 📰 Published: June 9, 2026 at 17:07
- 🔍 Collected: June 9, 2026 at 17:29 (22 min after Published)
- 🤖 AI Analyzed: June 9, 2026 at 17:31 (2 min after Collected)
(CNA, Taipei, by reporter Chung Jung-feng, June 9) Major semiconductor packaging and testing firm ASE Technology Holding announced this afternoon its unaudited consolidated revenue for May reached NT$63.033 billion, a 1.3% increase month-over-month and a 28.6% increase year-over-year, setting a new record for the same period. The company's cumulative unaudited revenue for the first five months of the year was NT$298.942 billion, a 19.87% year-over-year increase, also a record high for the period.
Of this, ASE's unaudited revenue from packaging, testing, and materials in May was NT$42.162 billion, up 4.1% month-over-month and 37.9% year-over-year.
ASE Technology Holding is optimistic about its advanced packaging (LEAP) business. The company previously stated that the growth of the LEAP business this year is better than expected and could increase by another 10% from the original estimate to US$3.5 billion. Within the LEAP business, 75% of the revenue comes from packaging and 25% from testing.
ASE stated that its turnkey projects for advanced packaging are proceeding continuously. Corporate analysts expect the company's revenue from turnkey advanced packaging solutions to reach US$300 million this year.
ASE's subsidiary, ASE Semiconductor, announced at the end of May that it has developed a 310mm x 310mm automated production line for Panel-Level Packaging, which is expected to enter mass production in the first half of 2027 to meet the advanced packaging demands for Artificial Intelligence (AI) accelerators and High-Performance Computing (HPC) components. (Editor: Yang Lan-hsuan) 1150609
Of this, ASE's unaudited revenue from packaging, testing, and materials in May was NT$42.162 billion, up 4.1% month-over-month and 37.9% year-over-year.
ASE Technology Holding is optimistic about its advanced packaging (LEAP) business. The company previously stated that the growth of the LEAP business this year is better than expected and could increase by another 10% from the original estimate to US$3.5 billion. Within the LEAP business, 75% of the revenue comes from packaging and 25% from testing.
ASE stated that its turnkey projects for advanced packaging are proceeding continuously. Corporate analysts expect the company's revenue from turnkey advanced packaging solutions to reach US$300 million this year.
ASE's subsidiary, ASE Semiconductor, announced at the end of May that it has developed a 310mm x 310mm automated production line for Panel-Level Packaging, which is expected to enter mass production in the first half of 2027 to meet the advanced packaging demands for Artificial Intelligence (AI) accelerators and High-Performance Computing (HPC) components. (Editor: Yang Lan-hsuan) 1150609
FAQ
日月光投控2024年5月的營收表現如何？
日月光投控2024年5月自結合併營收為新台幣630.33億元，月增1.3%、年增28.6%，創下歷年同期新高。
推動日月光投控營收成長的主要業務是什麼？
先進封測（LEAP）業務是主要推動力。公司看好此業務成長將優於預期，預估今年可達35億美元，其中75%來自封裝，25%來自測試。
日月光在先進封裝方面有什麼新技術發展？
日月光半導體開發出310mm x 310mm的面板級封裝（Panel-Level Packaging）自動化產線，預計2027年上半年投入量產，以滿足AI加速器和高效能運算（HPC）元件的需求。
法人如何預期日月光投控今年的先進封裝全製程營收？
法人預期日月光投控今年的先進封裝全製程營收可達到3億美元。
日月光投控今年前五個月的累計營收狀況？
累計2024年前5月，日月光投控自結營收為2989.42億元，年增19.87%，同樣創下歷年同期新高。