Hon Hai Announces Strategic Collaboration with Intel to Develop Comprehensive AI Solutions

Hon Hai today announced a strategic collaboration with Intel. Combining Intel's processors, silicon photonics technology, and software ecosystem with Hon Hai's global manufacturing, system integration, and artificial intelligence (AI) data center deployment capabilities, the two parties will jointly explore comprehensive AI solutions from chips, racks, and systems to applications, accelerating the advancement of edge AI and Physical AI applications.

In a press release, Hon Hai explained that in the AI Rack domain, the two parties will explore the development and commercialization of rack-level AI infrastructure solutions, encompassing racks based on Intel Xeon processors and AI accelerator architectures. They will also jointly advance key technologies such as high-speed interconnect, thermal and liquid cooling design, system monitoring, and AI data center scalability to provide more efficient and energy-efficient AI deployment solutions.

In the Edge AI and Physical AI domains, Hon Hai stated it will work with Intel to jointly define the next-generation Edge AI and Physical AI platform architecture and lay out application directions including Agentic AI, edge intelligence, and robotics. The related collaboration will further promote and support diverse scenarios such as smart manufacturing, smart cities, automotive, and robotics.

Hon Hai further explained that it will explore collaboration opportunities with Intel in design services for custom application-specific integrated circuits (ASICs), system-on-chips (SoCs), and system integration. Combining Intel's comprehensive chip capabilities with Hon Hai's design and manufacturing ecosystem, this collaboration covers chips, modules, and systems, expanding global market opportunities.

Hon Hai Chairman Young Liu stated that AI is rapidly reshaping global industries and societal operations. This collaboration with Intel will combine the strengths of both parties in computing platforms, system integration, and global supply chains to jointly build a new generation of AI infrastructure, edge AI, and Physical AI ecosystems, accelerating the implementation of AI applications.

Intel CEO Lip-Bu Tan stated that the rapid growth of AI, especially the rise of large-scale inference and agentic AI workloads, is redefining the capabilities required for modern computing. These demands rely on comprehensive innovation across the entire technology stack, from next-generation silicon and chip design to rack-level systems and the deployment of edge AI and Physical AI.

Tan pointed out that the collaboration between Intel and Hon Hai brings together the expertise of both parties in chip design, rack-level solutions, and global system integration. Together, they will accelerate the development of end-to-end platforms, unlock new capabilities, and further expand AI's global impact. (Editor: Pan Yi-Jing) 1150604