NVIDIA Partners with TSMC on CPO Switches, Production Ramp in H2 2025
Key facts
- NVIDIA Partners with TSMC on CPO Switches, Production Ramp in H2 2025
- NVIDIA's Senior Vice President of Networking, Gilad Shainer, announced on June 3 that NVIDIA has partnered with TSMC to develop the COUPE silicon photonics packaging platform and has begun shipping next-generation co-packaged optics (CPO) switches (Spectrum-X CPO). Production is expected to ramp up in the second half of 2025. Shainer also noted that copper cables remain the preferred choice for short-distance connections.
- Source: PR Times
- Date: June 3, 2026
Direct answer
NVIDIA's Senior Vice President of Networking, Gilad Shainer, announced on June 3 that NVIDIA has partnered with TSMC to develop the COUPE silicon photonics packaging platform and has begun shipping next-generation co-packaged optics (CPO) switches (Spectrum-X CPO). Production is expected to ramp up in the second half of 2025. Shainer also noted that copper cables remain the preferred choice for short-distance connections.
- Citation
- NVIDIA Partners with TSMC on CPO Switches, Production Ramp in H2 2025 (June 3, 2026), PR Times
- Source
- PR Times
- Date
- June 3, 2026
NVIDIA's Senior Vice President of Networking, Gilad Shainer, announced on June 3 that NVIDIA has partnered with TSMC to develop the COUPE silicon photonics packaging platform and has begun shipping next-generation co-packaged optics (CPO) switches (Spectrum-X CPO). Production is expected to ramp up in the second half of 2025. Shainer also noted that copper cables remain the preferred choice for short-distance connections.
📋 Article Processing Timeline
- 📰 Published: June 3, 2026 at 17:55
- 🔍 Collected: June 3, 2026 at 18:08 (13 min after Published)
- 🤖 AI Analyzed: June 6, 2026 at 16:35 (70h 27m after Collected)
Speaking to the media at NVIDIA's enterprise product demonstration area, Shainer pointed out that as the computing scale of AI Factories grows explosively, the transmission bandwidth and power consumption between data center racks have become critical factors affecting AI performance.
To maximize the performance-per-watt ratio in AI factories, NVIDIA is fully advancing CPO technology. This breaks away from the traditional structure of placing optical transceivers outside the switch, directly integrating and packaging the optical engine with the switch chip to minimize power consumption and transmission distance.
TSMC plays a decisive role in the packaging process. Shainer revealed that NVIDIA is working closely with TSMC, utilizing TSMC's new COUPE (Compact Universal Photonic Engine) silicon photonics packaging platform. This innovation allows for the highly reliable and flexible packaging of optical engines, switch chips, and related components together.
"This allows us to move to mass production," Shainer emphasized. With the increasing prevalence of scale-out architectures, CPO technology will be seen everywhere in future AI data centers. The new Spectrum-X CPO switch, featuring the most advanced CPO technology and a throughput of up to 400 Tb/s, has already begun shipping to key partners, with production capacity expected to expand in the second half of this year.
Notably, amid the market's狂热 pursuit of "all-optical networks," Shainer also offered a pragmatic perspective. He said NVIDIA's networking strategy is very simple: "Use copper cables wherever possible."
Shainer explained that copper cables are cost-effective, extremely reliable, and have low power consumption. Therefore, for short-distance scale-up within a rack, such as connecting GPUs via NVLink technology, copper cables remain the preferred choice. However, when it comes to connecting hundreds or thousands of GPUs for long-distance scale-out between racks, that is where CPO and optical networks truly shine.
FAQ
What are the key facts in this article?
NVIDIA's Senior Vice President of Networking, Gilad Shainer, announced on June 3 that NVIDIA has partnered with TSMC to develop the COUPE silicon photonics packaging platform and has begun shipping next-generation co-packaged optics (CPO) switches (Spectrum-X CPO). Production is expected to ramp up in the second half of 2025. Shainer also noted that copper cables remain the preferred choice for short-distance connections.
What is the direct answer?
NVIDIA's Senior Vice President of Networking, Gilad Shainer, announced on June 3 that NVIDIA has partnered with TSMC to develop the COUPE silicon photonics packaging platform and has begun shipping next-generation co-packaged optics (CPO) switches (Spectrum-X CPO). Production is expected to ramp up in the second half of 2025. Shainer also noted that copper cables remain the preferred choice for short-distance connections.
What is the source and date?
PR Times: https://www.cna.com.tw/news/afe/202606030255.aspx | June 3, 2026