Taiwan's FCFC Partners with Japanese Firm to Enter Semiconductor Supply Chain, Mass Production Expected by Year-End
Formosa Chemicals & Fibre Corporation (FCFC) announced on June 3, 2025, that it has entered a technology licensing agreement with Japan Polypropylene Corporation (JPP) to develop metallocene PP ultra-clean materials, successfully breaking into the semiconductor supply chain. FCFC becomes the world's third supplier of PP wafer carrier materials, with mass production expected by the end of this year. The company is also advancing a 5N5 high-purity electronic-grade low-carbon hydrogen project, targeting production start in Q3 2027.
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- 📰 Published: June 3, 2026 at 16:40
- 🔍 Collected: June 3, 2026 at 16:58 (18 min after Published)
- 🤖 AI Analyzed: June 6, 2026 at 16:41 (71h 43m after Collected)
FCFC participated in COMPUTEX Taipei for the first time this year, marking the first such exhibition by any company in the Formosa Plastics Group. FCFC revealed that it is collaborating with Japan Polypropylene Corporation (JPP) through a technology licensing agreement to develop metallocene PP (polypropylene) ultra-clean materials, entering the semiconductor manufacturing supply chain, with mass production expected by the end of this year.
FCFC President Lu Wen-chin stated today that FCFC is actively developing various high-performance composite materials, including PC (polycarbonate), PC/ABS and other high-value modified materials, and is also investing in the development of high-temperature engineering plastics such as aromatic nylon and PEEK (polyether ether ketone). These composite materials offer advantages such as high strength, light weight, flame retardancy, and weather resistance, and can be applied in fields such as drones, humanoid robots, AI servers, AI laptops, 5G/6G network communications, and semiconductor carriers.
Specifically, FCFC is cooperating with Japan's JPP to develop metallocene PP. Utilizing advanced metallocene catalyst technology, the material features low odor and low VOC (volatile organic compounds) performance, meeting the semiconductor industry's stringent cleanliness requirements. It has been adopted for wafer boxes and carrier boxes used in semiconductor manufacturing processes, making FCFC the world's third supplier of PP wafer carrier materials. Mass production is expected to begin by the end of this year.
Lu stated that FCFC's current annual revenue from high-performance composite materials is approximately NT$10 billion, accounting for about 4% of total revenue. FCFC aims to increase the revenue share of high-performance composite materials to 30% within three years. As the gross profit margin for these products can reach over 30%, far higher than FCFC's current single-digit gross margin, this is expected to boost overall profitability.
FCFC is also promoting a 5N5 high-purity electronic-grade low-carbon hydrogen project. The plan is to use hydrogen, a byproduct of existing petrochemical processes, as a raw material to produce low-carbon hydrogen, with production scheduled to begin in the third quarter of 2027.
FCFC emphasized that this electronic-grade low-carbon hydrogen has obtained third-party carbon footprint certification, with a hydrogen carbon footprint of 0.52 kg CO₂e/kgH₂, approximately 1/20th of mainstream hydrogen production technologies. Electronic-grade hydrogen can be used in reduction reactions, cleaning, and protective environments in semiconductor wafer manufacturing processes. FCFC also plans to develop electronic-grade specialty gases to support the needs of semiconductor, panel, and LED manufacturing processes.
FCFC President Lu Wen-chin stated today that FCFC is actively developing various high-performance composite materials, including PC (polycarbonate), PC/ABS and other high-value modified materials, and is also investing in the development of high-temperature engineering plastics such as aromatic nylon and PEEK (polyether ether ketone). These composite materials offer advantages such as high strength, light weight, flame retardancy, and weather resistance, and can be applied in fields such as drones, humanoid robots, AI servers, AI laptops, 5G/6G network communications, and semiconductor carriers.
Specifically, FCFC is cooperating with Japan's JPP to develop metallocene PP. Utilizing advanced metallocene catalyst technology, the material features low odor and low VOC (volatile organic compounds) performance, meeting the semiconductor industry's stringent cleanliness requirements. It has been adopted for wafer boxes and carrier boxes used in semiconductor manufacturing processes, making FCFC the world's third supplier of PP wafer carrier materials. Mass production is expected to begin by the end of this year.
Lu stated that FCFC's current annual revenue from high-performance composite materials is approximately NT$10 billion, accounting for about 4% of total revenue. FCFC aims to increase the revenue share of high-performance composite materials to 30% within three years. As the gross profit margin for these products can reach over 30%, far higher than FCFC's current single-digit gross margin, this is expected to boost overall profitability.
FCFC is also promoting a 5N5 high-purity electronic-grade low-carbon hydrogen project. The plan is to use hydrogen, a byproduct of existing petrochemical processes, as a raw material to produce low-carbon hydrogen, with production scheduled to begin in the third quarter of 2027.
FCFC emphasized that this electronic-grade low-carbon hydrogen has obtained third-party carbon footprint certification, with a hydrogen carbon footprint of 0.52 kg CO₂e/kgH₂, approximately 1/20th of mainstream hydrogen production technologies. Electronic-grade hydrogen can be used in reduction reactions, cleaning, and protective environments in semiconductor wafer manufacturing processes. FCFC also plans to develop electronic-grade specialty gases to support the needs of semiconductor, panel, and LED manufacturing processes.