[Live Webinar/ZOOM] Seminar on "Fundamentals of Backend Process, Assembly, and Design in Semiconductor Manufacturing" to be held!
Key facts
- [Live Webinar/ZOOM] Seminar on "Fundamentals of Backend Process, Assembly, and Design in Semiconductor Manufacturing" to be held!
- CMC Research will hold a live webinar on semiconductor packaging technology on July 3, 2026.
- Source: PR Times
- Date: June 5, 2026
Direct answer
CMC Research will hold a live webinar on semiconductor packaging technology on July 3, 2026.
- Citation
- [Live Webinar/ZOOM] Seminar on "Fundamentals of Backend Process, Assembly, and Design in Semiconductor Manufacturing" to be held! (June 5, 2026), PR Times
- Source
- PR Times
- Date
- June 5, 2026
CMC Research will hold a live webinar on semiconductor packaging technology on July 3, 2026.
📋 Article Processing Timeline
- 📰 Published: June 5, 2026 at 19:30
- 🔍 Collected: June 5, 2026 at 10:51
- 🤖 AI Analyzed: June 6, 2026 at 16:54 (30h 2m after Collected)
CMC Research (https://cmcre.com/) is hosting a live webinar.
Instructor: Yosuke Hirumuta (Quality and Technology Consultant, Hirumuta Professional Engineer Office)
Date and Time: Friday, July 3, 2026, 13:30–16:30
Theme: "Fundamentals of Backend Process, Assembly, and Design in Semiconductor Manufacturing"
Learn packaging technology, which determines the performance of AI semiconductors, from the basics. Participants will systematically understand failure cases, evaluation analysis, chiplets, and advanced assembly technologies.
Registration Fees:
- General: 44,000 JPY (tax included)
- Newsletter Members: 39,600 JPY (tax included)
- Academic: 26,400 JPY (tax included)
Seminar Topics:
1. Basics of Semiconductor Packaging (evolution and development)
2. Packaging Processes (representative examples)
3. Technical Key Points of Manufacturing Processes
4. Past Failure Examples
Registration is available on the official CMC Research website.
Instructor: Yosuke Hirumuta (Quality and Technology Consultant, Hirumuta Professional Engineer Office)
Date and Time: Friday, July 3, 2026, 13:30–16:30
Theme: "Fundamentals of Backend Process, Assembly, and Design in Semiconductor Manufacturing"
Learn packaging technology, which determines the performance of AI semiconductors, from the basics. Participants will systematically understand failure cases, evaluation analysis, chiplets, and advanced assembly technologies.
Registration Fees:
- General: 44,000 JPY (tax included)
- Newsletter Members: 39,600 JPY (tax included)
- Academic: 26,400 JPY (tax included)
Seminar Topics:
1. Basics of Semiconductor Packaging (evolution and development)
2. Packaging Processes (representative examples)
3. Technical Key Points of Manufacturing Processes
4. Past Failure Examples
Registration is available on the official CMC Research website.
FAQ
セミナーの開催日時はいつですか？
2026年7月3日（金）13:30～16:30に開催されます。
セミナーの講師は誰ですか？
蛭牟田技術士事務所の品質・技術コンサルタントである蛭牟田要介氏が務めます。
セミナーではどのような内容を学べますか？
半導体パッケージの基礎、製造プロセス、封止技術、評価解析技術、2.5D/3Dパッケージング、チップレット技術などを体系的に学びます。
参加費用はいくらですか？
一般価格は44,000円（税込）、メルマガ会員は39,600円（税込）、アカデミック価格は26,400円（税込）です。
申し込み方法は？
シーエムシー・リサーチの公式サイトより申し込みが可能です。