[Live Streaming/ZOOM] Seminar: "Basic Course on Semiconductor Packaging Technology" to be held on July 2, 2026 (Thu) Organized by CMC Research Co., Ltd.

Organizer: CMC Research Co., Ltd. (https://cmcre.com/) announces the holding of a notable live streaming seminar.

Lecturer: Mr. Akira Isobe (President and Representative Director, ISTL Co., Ltd.)
Date and Time: July 2, 2026 (Thursday) 13:30 - 16:30
Zoom delivery (with materials)

Theme: "Basic Course on Semiconductor Packaging Technology: From the Evolution of Package Forms, Manufacturing Processes and Equipment/Materials Used, to the Latest Trends"
-- An overview of packaging technology supporting semiconductor evolution after the limits of Moore's Law. Organizing the forefront including CoWoS, chiplets, and photonics-electronics convergence.

Participation Fee
・General: 44,000 yen (tax included)
・Newsletter Member: 39,600 yen (tax included)
・Academic: 26,400 yen (tax included)

Details and application here

There will also be a Q&A session. Please join us for application in your research and business!

[Knowledge Gained from the Seminar]
・History and background of semiconductor packaging technology
・Semiconductor packaging manufacturing processes, materials, and equipment
・Cutting-edge packaging technology and future directions

[Target Audience]
・Engineers who want to learn semiconductor packaging technology from the basics
・Sales staff
・Marketing staff
・Companies newly entering the semiconductor industry
・Those who want to grasp the latest trends in advanced packaging technology

1) Seminar Theme and Date/Time

Theme: Basic Course on Semiconductor Packaging Technology: From the Evolution of Package Forms, Manufacturing Processes and Equipment/Materials Used, to the Latest Trends

Date and Time: July 2, 2026 (Thursday) 13:30 - 16:30

Participation Fee: 44,000 yen (tax included) * Materials included
* Newsletter registrants: 39,600 yen (tax included)
* Academic price: 26,400 yen (tax included)

Lecturer: Mr. Akira Isobe, President and Representative Director, ISTL Co., Ltd.

[Seminar Purpose]

The evolution of semiconductor packaging technology in recent years, such as chiplets, heterogeneous integration, and photonics-electronics convergence, is remarkable. Until now, device performance improvement has been achieved through the miniaturization of front-end processes, but due to the limits of miniaturization, front-end processes have also become structurally complex, such as through 3D integration, and even then, it is insufficient, so packaging technology is accelerating its evolution.

To understand advanced packaging technology, this seminar will explain the evolution and elemental technologies of packaging technology from basic methods and manufacturing methods, making it easy to understand even for beginners.

*This seminar will be a live streaming seminar using the video conferencing tool "Zoom" on the day. Please refer to the tool for the recommended environment. The URL for viewing will be sent to you by email at a later date.

★Recording or photographing during the lecture is strictly prohibited.

2) Application Method

Please apply from the CMC Research seminar website. We will send you the URL for viewing by email. Please see the URL for details.

Apply here

3) Introduction of Seminar Program

(Breaks will be included)

1. Role of Semiconductor Packages
　1.1 Front-end and Back-end Processes
　1.2 Evolution of Board Mounting Methods
　1.3 Requirements for Semiconductor Packages

2. Evolution and Elemental Technologies of Semiconductor Packages
　2.1 Evolution of PCs and Mobile Phones and Changes in Package Forms
　2.2 STRJ Package Roadmap
　2.3 Explanation of Each Package Form
　　　～ DIP, QFP, TCP, BGA, QFP, WLCSP, etc.
　2.4 Elemental Technologies for Package Manufacturing
　　　～ Backgrinding, Dicing, Die Bonding, Wire Bonding, Molding, Bump Technology, etc.

3. Latest Packaging Technology and Future Directions
　3.1 Background Necessitating Advanced Packages
　　　～ Limits of Moore's Law
　3.2 Various SiPs
　3.3 What is FOWLP?
　3.4 What is CoWoS?
　3.5 What are Chiplets and EMIB?
　3.6 Photonics-Electronics Convergence Package
　3.7 Future Directions of Packaging Technology

4) Lecturer Introduction

Mr. Akira Isobe
President and Representative Director, ISTL Co., Ltd.

[Lecturer Career]

1984: Joined NEC Corporation, worked on semiconductor process technology, multilayer wiring technology, CMP, etc.

2002: Executive Officer and CMP Group Leader at Tokyo Seimitsu Co., Ltd.

2006: Joined Nitta Haas Incorporated, served as Technical Support Center Manager, etc.

2013: Joined Disco Corporation

2015: Established ISTL Co., Ltd.

[Activities]

Doctor of Engineering
Secretary of the Planarization & CMP Technical Committee

Affiliated Societies:
Japan Society for Precision Engineering
The Japan Society of Applied Physics
Electro Chemical Society

See details

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〇 Basic Information on Semiconductor (IC) Manufacturing Processes and Semiconductor Materials
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　https://cmcre.com/archives/143580/

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