【Live Stream/ZOOM】Seminar on "Basic Information on Semiconductor (IC) Manufacturing Processes and Materials ~ Introduction: Semiconductor Manufacturing and Materials - From Front-End to Back-End Processes and Implementation ~" to be held on June 11 (Thursday) Hosted by CMC Research Co., Ltd.

📢 Hosted by: CMC Research Co., Ltd. (https://cmcre.com/), we are pleased to announce a highly anticipated live streaming seminar.

🎓 Lecturer: Mr. Shigeru Koshibe (Representative Director, I-Pack Co., Ltd.)

📆 Date and Time: Thursday, June 11, 2026, 13:00-16:30

🖥️ Zoom delivery (with materials)

💬 Theme: "Basic Information on Semiconductor (IC) Manufacturing Processes and Materials ~ Introduction: Semiconductor Manufacturing and Materials - From Front-End to Back-End Processes and Implementation ~"

――A practical seminar to comprehensively understand the flow of semiconductor manufacturing and the relationship between materials, learning across equipment, materials, and implementation, and grasping Japan's strengths and technological structure.

📌 Tuition Fees

・General: 44,000 yen (tax included)

・Newsletter members: 39,600 yen (tax included)

・Academic: 26,400 yen (tax included)

🔗 Click here for details and application

🧠 There will also be a Q&A session.

Please join us to utilize this knowledge in your research and work!

【Knowledge to be gained from the seminar】

・Acquire basic information on semiconductor manufacturing

・Obtain information on Japanese technology active in the semiconductor field

・Gain insights into the potential for expanding your company's technology into the semiconductor field

【Target audience for the seminar】

・Those interested in basic technical information on semiconductor (IC) manufacturing

・Those interested in materials used in IC manufacturing

・Those interested in Japanese technology (equipment, materials) active in IC manufacturing

1) Seminar Theme and Date/Time

Theme: Basic Information on Semiconductor (IC) Manufacturing Processes and Materials ~ Introduction: Semiconductor Manufacturing and Materials - From Front-End to Back-End Processes and Implementation ~

Date and Time: Thursday, June 11, 2026, 13:00-16:30

Participation Fee: 44,000 yen (tax included) *With materials

* Newsletter registrants: 39,600 yen (tax included)

* Academic price: 26,400 yen (tax included)

Lecturer: Mr. Shigeru Koshibe, Representative Director, I-Pack Co., Ltd.

〈Seminar Purpose〉

Japan is active in the semiconductor field, including manufacturing equipment and materials. This seminar will explain the overall picture in an easy-to-understand manner. In the future, the information society will further develop, and the necessity of semiconductors will increase even more. For this reason, semiconductors are expected to continue to evolve, and their market will expand. This seminar will explain the flow from the manufacturing process of typical semiconductors = integrated circuits (ICs) to the mounting process on circuit boards, and the role and necessity of materials used in these processes. Acquiring this basic information on semiconductor manufacturing will be beneficial for future development of semiconductor materials.

*This seminar will be a live streaming seminar using the video conferencing tool "Zoom" on the day. Please refer to the tool for recommended environments. The URL for viewing will be sent separately by email at a later date.

★Recording and photography during the seminar are strictly prohibited.

2) How to apply

Please apply from CMC Research's seminar website.

The URL for viewing will be sent separately by email.

See the URL for details.

🔗 Click here to apply

3) Introduction to the Seminar Program

(Includes a break)

1. Overview of Semiconductor Manufacturing Processes (Overall Flow)

2. Front-End Processes and Related Materials

(1) Flow of Front-End Processes

(2) Wafer Manufacturing

1) Raw materials 2) Manufacturing method 3) Processing equipment 4) Process materials

(3) Wafer Processing (Unit Formation and Circuit Processing)

1) Unit formation 2) Circuit processing 3) Processing equipment 4) Process materials

3. Back-End Processes and Related Materials

(1) Flow of Back-End Processes

(2) Assembly Technology; 1) Mounting 2) Wiring 3) Encapsulation

(3) Encapsulation Technology; 1) Encapsulation method 2) Encapsulation materials

(4) Back-End Processes; 1) Processing equipment 2) Process materials

4. Implementation Processes and Related Materials

(1) Flow of Implementation Processes

(2) Circuit Boards; 1) Types 2) Manufacturing method

(3) Board Mounting; 1) Equipment 2) Process materials

【Q&A Session】

4) Lecturer Introduction

Mr. Shigeru Koshibe, Representative Director, I-Pack Co., Ltd.

【Lecturer's Career】

1974: Graduated from Osaka University, Faculty of Engineering

1976: Completed the first half of the Master's program at the Graduate School of Engineering, Osaka University

1976: Joined Sumitomo Bakelite, engaged in the development of encapsulation materials for semiconductors, etc.

1988: Joined Tonen Chemical, engaged in the development of silica, silicone gel, etc.

2001: Established I-Pack Co., Ltd., responsible for technical consulting for material development in the semiconductor and optical fields.

【Activities】

Patent applications > 200, Book publications > 60, Seminars > 200

【Activities/Book Publications】

Books related to semiconductor encapsulation

1) Nikkei Microdevices 1984.5.11, P82-92

・Low stress advancement