[Pre-release] Announcement of 'Next-Generation Electronics Technology Exhibition' to Transform the Industry
The announcement event for the 'Next-Generation Electronics Technology Exhibition' will be held on June 16th at Belle Salle Roppongi. Aiming to foster new growth in the electronics industry, which is being transformed by AI, IoT, and decarbonization, the event seeks to promote open technological exchange and business creation across different industries.
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- 📰 Published: May 12, 2026 at 17:50
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This executive committee will hold an announcement event as follows for the first exhibition specializing in electronics technology, the 'Next-Generation Electronics Technology Exhibition'.
Announcement Event HP
Background and Purpose of the Exhibition
AI, IoT, decarbonization. As all industries undergo drastic transformation, the role required of the electronics industry is also fundamentally changing. New growth trajectories can no longer be drawn on the conventional extensions of 'miniaturization' and 'cost reduction'. What is needed is open evolution that breaks out of closed development environments and combines unknown knowledge.
This executive committee will hold the first 'Next-Generation Electronics Technology Exhibition' as the forefront of business where solutions for breaking down departmental barriers and creating new value converge. By transcending boundaries and combining new technologies and trends, next-generation business opportunities will be born.
At the announcement event, we will declare the holding of the Next-Generation Electronics Technology Exhibition and host a special seminar with invited special guests to make it a beneficial event for participants.
Afterward, a networking event will also be held for optional participation, so please use it as an opportunity to meet future business partners and discover new perspectives and ideas.
Announcement Event Overview
Announcement Event Overview
■ Date: June 16th (Tuesday) 15:00 (doors open) (17:00 close)
■ Venue: Belle Salle Roppongi (B1F)
■ Participation: Limited to 300 people
■ Content: Exhibition overview (exhibitors, visitors, scale, seminars, etc.)
Lectures by industry experts
■ Participation Fee: Free
■ Networking Event: Same day, same venue, starting from 17:00
Expected Participants: Executives and marketing managers from the following companies:
SMT equipment, mounting-related materials/equipment, inspection/measurement, electronic components/materials,
Semiconductor/sensor packaging technology
*Light meals, alcoholic beverages, and soft drinks will be provided.
We hope that this announcement event will be an opportunity to jointly create the future of the electronics industry and foster initiatives for the overall development of the industry. We sincerely look forward to your participation.
Click here to apply
Guest Speaker Decided!
Semiconductor 300 Trillion Yen Market and the Future of the 'Global Automotive War'
~The Key to the Revival of Silicon Archipelago Japan: Cross-industry Collaboration of Electronics x Manufacturing~
Wataru Izumiya
Director and Chairman
Sangyo Times Co., Ltd.
Exhibitor Categories
Constituent Exhibitions and Exhibitor Categories
Next-Generation Electronics Manufacturing & Mounting EXPO
SMT (Surface Mount Technology) related equipment, mounting line automation/labor-saving robots
Rework/repair equipment, soldering technology, EMS/contract manufacturing services
Cleanroom/static electricity/noise countermeasures...etc.
Next-Generation Measurement & Analytics EXPO
AI visual inspection/image processing systems, non-destructive inspection (X-ray, CT, etc.)
Testers/measurement/testing/analysis equipment, yield improvement/predictive maintenance data analysis
Measurement data linkage solutions...etc.
Next-Generation Semiconductor & Sensor Packaging EXPO
3D mounting/chiplet related technology, semiconductor/sensor/MEMS assembly equipment
Power module mounting technology, next-generation packaging materials/components
Advanced plating/etching technology...etc.
Next-Generation Materials & Electronic Components EXPO
Next-generation electronic components, high-frequency compatible/miniaturization compatible materials, printed circuit boards/substrate materials
High-performance materials/sustainable materials, advanced thermal management/heat dissipation technology...etc.
Target Visitors
Manufacturers in electronics, semiconductors, electronic components, automotive, etc.
■ Manufacturing/Production Technology
■ Quality Assurance/Quality Control
■ Design/Development/Research
■ Procurement/Purchasing
■ DX/IT Promotion
■ Management/Corporate Planning
...etc.
[Contact Information]
Next-Generation Electronics Technology Exhibition Executive Committee Public Relations
TEL: 03-6632-2802
E-mail: electronics-s@bizcrew.jp
Announcement Event HP
Background and Purpose of the Exhibition
AI, IoT, decarbonization. As all industries undergo drastic transformation, the role required of the electronics industry is also fundamentally changing. New growth trajectories can no longer be drawn on the conventional extensions of 'miniaturization' and 'cost reduction'. What is needed is open evolution that breaks out of closed development environments and combines unknown knowledge.
This executive committee will hold the first 'Next-Generation Electronics Technology Exhibition' as the forefront of business where solutions for breaking down departmental barriers and creating new value converge. By transcending boundaries and combining new technologies and trends, next-generation business opportunities will be born.
At the announcement event, we will declare the holding of the Next-Generation Electronics Technology Exhibition and host a special seminar with invited special guests to make it a beneficial event for participants.
Afterward, a networking event will also be held for optional participation, so please use it as an opportunity to meet future business partners and discover new perspectives and ideas.
Announcement Event Overview
Announcement Event Overview
■ Date: June 16th (Tuesday) 15:00 (doors open) (17:00 close)
■ Venue: Belle Salle Roppongi (B1F)
■ Participation: Limited to 300 people
■ Content: Exhibition overview (exhibitors, visitors, scale, seminars, etc.)
Lectures by industry experts
■ Participation Fee: Free
■ Networking Event: Same day, same venue, starting from 17:00
Expected Participants: Executives and marketing managers from the following companies:
SMT equipment, mounting-related materials/equipment, inspection/measurement, electronic components/materials,
Semiconductor/sensor packaging technology
*Light meals, alcoholic beverages, and soft drinks will be provided.
We hope that this announcement event will be an opportunity to jointly create the future of the electronics industry and foster initiatives for the overall development of the industry. We sincerely look forward to your participation.
Click here to apply
Guest Speaker Decided!
Semiconductor 300 Trillion Yen Market and the Future of the 'Global Automotive War'
~The Key to the Revival of Silicon Archipelago Japan: Cross-industry Collaboration of Electronics x Manufacturing~
Wataru Izumiya
Director and Chairman
Sangyo Times Co., Ltd.
Exhibitor Categories
Constituent Exhibitions and Exhibitor Categories
Next-Generation Electronics Manufacturing & Mounting EXPO
SMT (Surface Mount Technology) related equipment, mounting line automation/labor-saving robots
Rework/repair equipment, soldering technology, EMS/contract manufacturing services
Cleanroom/static electricity/noise countermeasures...etc.
Next-Generation Measurement & Analytics EXPO
AI visual inspection/image processing systems, non-destructive inspection (X-ray, CT, etc.)
Testers/measurement/testing/analysis equipment, yield improvement/predictive maintenance data analysis
Measurement data linkage solutions...etc.
Next-Generation Semiconductor & Sensor Packaging EXPO
3D mounting/chiplet related technology, semiconductor/sensor/MEMS assembly equipment
Power module mounting technology, next-generation packaging materials/components
Advanced plating/etching technology...etc.
Next-Generation Materials & Electronic Components EXPO
Next-generation electronic components, high-frequency compatible/miniaturization compatible materials, printed circuit boards/substrate materials
High-performance materials/sustainable materials, advanced thermal management/heat dissipation technology...etc.
Target Visitors
Manufacturers in electronics, semiconductors, electronic components, automotive, etc.
■ Manufacturing/Production Technology
■ Quality Assurance/Quality Control
■ Design/Development/Research
■ Procurement/Purchasing
■ DX/IT Promotion
■ Management/Corporate Planning
...etc.
[Contact Information]
Next-Generation Electronics Technology Exhibition Executive Committee Public Relations
TEL: 03-6632-2802
E-mail: electronics-s@bizcrew.jp