Starting from July 29th, a 3-month consecutive training program by AndTech: "Basics, Evaluation, Selection, and Latest Technologies of Tape Materials in Semiconductor Backgrinding/Dicing Processes [3-Month Training: Web Live & Archived Lectures]"

AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture, Representative Director and President: Masao Toyama, hereinafter referred to as AndTech) will open a lecture series on "Tape Materials in Semiconductor Backgrinding/Dicing Processes" as part of its R&D development support Zoom lectures. This is in response to the growing need for solving issues related to tape materials in semiconductor backgrinding/dicing processes. The lectures will be given by leading experts in the field.

The theme of the lectures will be "Adhesive Tapes," "Dicing Tapes," and "Backgrinding Tapes," with the aim of acquiring knowledge over three months (three sessions in total) in a practical, expert-oriented training course!

Group registration is available for one company with 1-5 participants! Exercises and corrections will be conducted to ensure understanding by the participants.

Session 1: July 29th [Acquiring the Basic Composition and Evaluation Methods of Adhesive Tapes]

Session 2: August 27th [What is a Backgrinding Tape?]

Session 3: September 28th [What is a Dicing Tape? And Introduction to New Applications of Tapes]

The above will be introduced as three sessions.

Details: https://andtech.co.jp/seminars/1f15a561-90aa-6b1a-a35e-064fb9a95405

Live Streaming & Web Seminar Overview

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Theme: Basics, Evaluation, Selection, and Latest Trends of Tape Materials in Semiconductor Backgrinding/Dicing Processes ~ Tapes for DBG/SDBG Processes and Still/Plasma Dicing, UV-Curable Adhesives, and New Applications for Hybrid Bonding [3-Month Training: Live & Archived Continuous Lectures]

Start Date and Time: August 21, 2026 (Fri) 13:30-17:30

Session 1: July 29th [Acquiring the Basic Composition and Evaluation Methods of Adhesive Tapes]

（Viewing via archived video: Distribution period: August 1-31, 2026, Lecture time: approximately 2 hours）

※Pre-notification from the secretariat to participants (materials URL, distributed lecture materials, etc.)

Session 2: August 27th [What is a Backgrinding Tape?]

（Viewing via archived video: Distribution period: September 1-30, 2026, Lecture time: approximately 2 hours）

※After the lecture, exercise questions and answer sheets will be distributed to participants

Session 3: September 28th [What is a Dicing Tape? And Introduction to New Applications of Tapes]

（Choose between on-site participation or web viewing: The scheduled date will be one weekday between October 1-30, to be decided after the opening is determined. Lecture (2h) + Exercise Explanation & Q&A (1h))

U　R　L: https://andtech.co.jp/seminars/1f15a561-90aa-6b1a-a35e-064fb9a95405

Web Distribution Format: Zoom (URL will be sent after registration)

Seminar Lecture Content Composition

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Program & Lecturer

Lintec Corporation Next-Generation Technology Innovation Division / Deputy Division Manager Shinya Taguchi

Knowledge and Technical Issues That Can Be Learned in This Seminar

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Learn the basic structure of adhesive tapes, the mechanism of adhesive properties, and various evaluation methods from the basics!

Explain the roles and technical issues of various tapes used in backgrinding and dicing processes, and selection points from a practical perspective!

Introduce new tape technologies and application expansions for hybrid bonding and advanced packaging!

Format of This Seminar

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This will be a live seminar using the web conferencing tool "Zoom". Details will be provided after registration.

About AndTech Co., Ltd.

──────────── Providing research and development support services for clients in a wide range of fields, including chemicals, materials, electronics, automotive, energy, medical devices, food packaging, and building materials. We have a team of top-notch instructors and provide a variety of services, starting with "Technical Seminars & Lectures," "Instructor Dispatch," "Publishing," "Consultant Dispatch," "Market Trend Surveys," "Business Matching," and "Business Development Consulting." We listen to our clients' needs and provide effective support for their entry into new business areas and markets. https://andtech.co.jp/

AndTech Co., Ltd. Technical Lecture List

───────────────── We hold numerous web lecture seminars with top instructors every month. https://andtech.co.jp/seminars/search

AndTech Co., Ltd. Book List

────────────── We select and publish books on themes that are in high demand. https://andtech.co.jp/books

AndTech Co., Ltd. Consulting Services

───────────────────── We dispatch highly specialized technical consultants with extensive experience. https://andtech.co.jp/business-consulting

Inquiries Regarding This Matter

───────────── AndTech Co., Ltd. PR & Public Relations Aoki Email Address: pr●andtech.co.jp (Please change ● to @ and contact us)

Below is the full program (Please refer if you are interested in details)

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【Main Theme, Situation, Key Points, and Overall Schedule of This Seminar】

Main Theme and Situation of This Lecture

★ With the increasing demand for AI-generated and HPC-oriented semiconductors, attention is growing towards advanced packaging and hybrid bonding technologies.

★ As one of the key technologies supporting the manufacturing of these advanced semiconductors, the importance of functional adhesive materials such as backgrinding tapes and dicing tapes is rapidly increasing.

★ This lecture will systematically explain the basics of adhesive tapes, the functions required in semiconductor manufacturing processes, and the latest process-compatible technologies.

Key Points

★ Learn the basic structure of adhesive tapes, the mechanism of adhesive properties, and various evaluation methods from the basics!

★ Explain the roles and technical issues of various tapes used in backgrinding and dicing processes, and selection points from a practical perspective!

★ Introduce new tape technologies and application expansions for hybrid bonding and advanced packaging!

Overall Schedule [Planned]

Session 1: July 29th [Acquiring the Basic Composition and Evaluation Methods of Adhesive Tapes]

（Viewing via archived video: Distribution period: August 1-31, 2026, Lecture time: approximately 2 hours）

※Pre-notification from the secretariat to participants (materials URL, distributed lecture materials, etc.)

Session 2: August 27th [What is a Backgrinding Tape?]

（Viewing via archived video: Distribution period: September 1-30, 2026, Lecture time: approximately 2 hours）

※After the lecture, exercise questions will be distributed to participants

Keywords: