AndTech to Hold Semiconductor Cleaning & Wafer-to-Wafer Bonding Zoom Seminar on July 30
AndTech will host a Zoom seminar on July 30, 2026, on semiconductor cleaning basics and advanced cleaning/drying technologies for 3D integration and Wafer-to-Wafer bonding, featuring SCREEN's Hiroyuki Fukue.
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- 📰 Published: June 5, 2026 at 00:19
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On July 30, 2026, AndTech will hold a Zoom seminar titled 'Semiconductor Cleaning Basics and Advanced Cleaning/Drying Technology for 3D Integration and Wafer-to-Wafer Bonding: Challenges and Prospects' from 13:00 to 16:00 JST. Led by Hiroyuki Fukue from SCREEN Semiconductor Solutions, the course will cover wet cleaning/drying fundamentals, technical trends, and issues associated with device miniaturization, 3D integration, and drying defects. The seminar will also discuss cleaning and bonding challenges before and after Wafer-to-Wafer processes. The participation fee is 38,500 yen (including tax), with digital materials distributed to attendees. AndTech provides research and development support services including technical seminars, consulting, and market trend research across chemistry, electronics, and medical devices.
FAQ
What is the theme of this seminar?
The basics of semiconductor cleaning and the challenges and prospects of advanced cleaning/drying technologies for 3D integration and Wafer to Wafer bonding.
When will the seminar be held?
July 30, 2026 (Thursday) from 13:00 to 16:00.
How much is the participation fee?
38,500 yen (tax included), which includes electronic materials.
Who is the lecturer?
Mr. Hiroyuki Fukue from the Advanced Process Development Section, Alliance Promotion Department, R&D Strategy Division at SCREEN Semiconductor Solutions.
What is the format of the seminar and the detailed URL?
It is a live streaming seminar using Zoom, and the URL is https://andtech.co.jp/seminars/1f158aa2-12d7-6690-ab29-064fb9a95405.