AndTech to Host Online Zoom Seminar on 'Hot-Melt Adhesives' on July 31
Key facts
- AndTech to Host Online Zoom Seminar on 'Hot-Melt Adhesives' on July 31
- 株式会社AndTech will host an online seminar on July 31, 2026, focusing on the basics, development trends, and machine learning implementation for hot-melt adhesives.
- Source: PR Times
- Date: May 30, 2026
Direct answer
株式会社AndTech will host an online seminar on July 31, 2026, focusing on the basics, development trends, and machine learning implementation for hot-melt adhesives.
- Citation
- AndTech to Host Online Zoom Seminar on 'Hot-Melt Adhesives' on July 31 (May 30, 2026), PR Times
- Source
- PR Times
- Date
- May 30, 2026
株式会社AndTech will host an online seminar on July 31, 2026, focusing on the basics, development trends, and machine learning implementation for hot-melt adhesives.
📋 Article Processing Timeline
- 📰 Published: May 30, 2026 at 03:11
- 🔍 Collected: May 29, 2026 at 18:17
- 🤖 AI Analyzed: May 29, 2026 at 18:18 (0 min after Collected)
株式会社AndTech is organizing an online Zoom seminar on 'Hot-Melt Adhesives' as part of its R&D support services.
Responding to growing needs for problem-solving in hot-melt adhesives, the seminar will feature industry-leading experts explaining the basics, the latest development trends, and efforts to introduce machine learning for environmental load reduction.
Date and Time: July 31, 2026 (Friday) 13:00-16:35
Format: Zoom Online
Fee: 55,000 JPY (tax included)
Program:
Part 1: Development trends of hot-melt adhesives and environmental response (Mr. Masahiko Hashimoto, MORESCO Corporation)
Part 2: Types, advances, and applications of hot-melt and reactive hot-melt adhesives (Mr. Kazutami Wakabayashi, APS Research)
Part 3: Development of labels for chilled environments using hot-melt adhesives and applications in the food industry (Mr. Tomoki Yoshita, Lintec Corporation)
Participants will gain specialized technical knowledge, including eco-friendly design, utilization of biomass materials, and practical case studies of machine learning.
Responding to growing needs for problem-solving in hot-melt adhesives, the seminar will feature industry-leading experts explaining the basics, the latest development trends, and efforts to introduce machine learning for environmental load reduction.
Date and Time: July 31, 2026 (Friday) 13:00-16:35
Format: Zoom Online
Fee: 55,000 JPY (tax included)
Program:
Part 1: Development trends of hot-melt adhesives and environmental response (Mr. Masahiko Hashimoto, MORESCO Corporation)
Part 2: Types, advances, and applications of hot-melt and reactive hot-melt adhesives (Mr. Kazutami Wakabayashi, APS Research)
Part 3: Development of labels for chilled environments using hot-melt adhesives and applications in the food industry (Mr. Tomoki Yoshita, Lintec Corporation)
Participants will gain specialized technical knowledge, including eco-friendly design, utilization of biomass materials, and practical case studies of machine learning.
FAQ
When is the seminar scheduled to take place?
It is scheduled for Friday, July 31, 2026.
What is the format of the seminar?
It will be a live stream using the web conferencing tool 'Zoom'.
How much is the participation fee?
It is 55,000 yen including tax. The materials will be distributed electronically.
What are the main topics of this seminar?
We will learn about the basics and development trends of hot melt adhesives, efforts to reduce environmental impact through the introduction of machine learning, and applications in the automotive and food industries.
Which companies do the scheduled speakers belong to?
The speakers are from MORESCO Corporation, APS Research, and LINTEC Corporation.