AndTech to Host Online Seminar on 'Liquid Metal Fundamentals and Applications in Flexible/Stretchable Devices' on June 29
AndTech will hold a webinar on June 29 focusing on liquid metal properties and their applications in next-generation devices as part of its R&D support services. Professor Yuki Ota from Yokohama National University will discuss the practical implementation processes for stretchable electronics.
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- 📰 Published: May 26, 2026 at 18:45
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AndTech (Headquarters: Kawasaki, Kanagawa; President: Masao Suyama) is launching a technical seminar on "Liquid Metals" as part of its Zoom-based R&D support courses, aiming to address the growing demand for solutions using liquid metal technologies.
The seminar covers fundamentals to next-generation device applications, including the physical, electrical, and thermal conductivity properties of these rare materials that remain liquid at room temperature. Participants will learn paths to cutting-edge applications such as stretchable wiring, wearable devices, and Thermal Interface Materials (TIM) through practical examples.
The seminar is scheduled for June 29, 2026.
Details: https://andtech.co.jp/seminars/1f11714d-c3c9-6b64-bb39-064fb9a95405
Seminar Overview
Theme: Fundamentals and Characteristics of Liquid Metal, and Applications in Flexible/Stretchable Devices
~Stretchable Electronics, Wearable Devices, Microfluidics, and TIM Applications~
Date & Time: Monday, June 29, 2026, 13:30-17:30
Fee: 45,100 JPY (tax included) *Digital materials to be provided
URL: https://andtech.co.jp/seminars/1f11714d-c3c9-6b64-bb39-064fb9a95405
Web Format: Zoom (URL provided after registration)
Program & Instructor
Instructor: Yuki Ota, Associate Professor, Graduate School of Engineering, Yokohama National University
Key Learning Objectives & Technical Challenges Addressed:
- Fundamentals and Advantages: Physical and chemical properties of liquid metals such as Ga and EGaIn (high thermal/electrical conductivity) and advantages over conventional materials (solid metals, conductive polymers).
- Practical Processing and Implementation: Patterning methods for stretchable wiring and thin-film deposition techniques using liquid metals, focusing on device integration processes.
- Next-Generation Device Applications: Case studies in stretchable electronics, wearable devices, and microfluidics, as well as approaches to "smartify" flexible/stretchable devices using machine learning.
- Other Applications: Practical challenges for Thermal Interface Materials (TIM), heat dissipation films, and gas barrier films utilizing liquid metal properties.
About AndTech
AndTech provides research and development support services, offering information to clients across a wide range of industries including chemistry, materials, electronics, automotive, energy, medical devices, food packaging, and construction materials.
The seminar covers fundamentals to next-generation device applications, including the physical, electrical, and thermal conductivity properties of these rare materials that remain liquid at room temperature. Participants will learn paths to cutting-edge applications such as stretchable wiring, wearable devices, and Thermal Interface Materials (TIM) through practical examples.
The seminar is scheduled for June 29, 2026.
Details: https://andtech.co.jp/seminars/1f11714d-c3c9-6b64-bb39-064fb9a95405
Seminar Overview
Theme: Fundamentals and Characteristics of Liquid Metal, and Applications in Flexible/Stretchable Devices
~Stretchable Electronics, Wearable Devices, Microfluidics, and TIM Applications~
Date & Time: Monday, June 29, 2026, 13:30-17:30
Fee: 45,100 JPY (tax included) *Digital materials to be provided
URL: https://andtech.co.jp/seminars/1f11714d-c3c9-6b64-bb39-064fb9a95405
Web Format: Zoom (URL provided after registration)
Program & Instructor
Instructor: Yuki Ota, Associate Professor, Graduate School of Engineering, Yokohama National University
Key Learning Objectives & Technical Challenges Addressed:
- Fundamentals and Advantages: Physical and chemical properties of liquid metals such as Ga and EGaIn (high thermal/electrical conductivity) and advantages over conventional materials (solid metals, conductive polymers).
- Practical Processing and Implementation: Patterning methods for stretchable wiring and thin-film deposition techniques using liquid metals, focusing on device integration processes.
- Next-Generation Device Applications: Case studies in stretchable electronics, wearable devices, and microfluidics, as well as approaches to "smartify" flexible/stretchable devices using machine learning.
- Other Applications: Practical challenges for Thermal Interface Materials (TIM), heat dissipation films, and gas barrier films utilizing liquid metal properties.
About AndTech
AndTech provides research and development support services, offering information to clients across a wide range of industries including chemistry, materials, electronics, automotive, energy, medical devices, food packaging, and construction materials.
FAQ
このセミナーの開催日はいつですか？
2026年06月29日(月) 13:30-17:30に開催予定です。
セミナーの参加費はいくらですか？
参加費は45,100円（税込）です。
セミナーの講師は誰ですか？
横浜国立大学 大学院工学研究院 システムの創生部門 准教授 太田 裕貴 氏が講師を務めます。
どのような技術が学べますか？
液体金属の基礎特性、ストレッチャブル配線の加工・実装、ウェアラブルデバイスや熱インターフェース材料（TIM）への応用、機械学習による知能化などを学べます。
参加形式はどうなっていますか？
Zoomを使用したライブ配信形式のWEBセミナーです。