AndTech to Host WEB Online Zoom Seminar on June 29 (Monday): "Current Status and Future Possibilities of Component-Embedded Substrate Technology as a Solution for High Integration and High Functionality"
AndTech Co., Ltd. will host an online Zoom seminar on June 29, 2026, focusing on component-embedded substrate technology as part of efforts to strengthen the semiconductor and digital industries for the AI era. Experts from Fukuoka University will present on the current state of this technology, which contributes to high integration and high functionality, and Japan's international standardization activities.
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AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture; Representative Director and President: Masao Toyama; hereinafter AndTech) will hold a seminar titled "Current Status and Future Possibilities of Component-Embedded Substrate Technology as a Solution for High Integration and High Functionality" as part of its Zoom lecture series for R&D development support, featuring leading experts on component-embedded substrate technology.
Amidst the strengthening of the semiconductor and digital industries in Japan and globally for the AI era, packaging technology, especially 3D packaging that enables high density, is becoming crucial. Among these, component-embedded substrate technology contributes to miniaturization, improved reliability, and enhanced high-frequency characteristics, serving as a foundational technology supporting the AI/IoT society and high-speed communication. This seminar will explain the development achievements of component-embedded substrates by the Fukuoka University Semiconductor Packaging Research Institute and Fukuoka IST, as well as the international standardization activities led by Japan.
This seminar is scheduled to commence on Monday, June 29, 2026.
Details: https://andtech.co.jp/seminars/1f142186-873f-66ee-88d1-064fb9a95405
Live Streaming/WEB Seminar Overview
Theme: Current Status and Future Possibilities of Component-Embedded Substrate Technology as a Solution for High Integration and High Functionality
Date and Time: Monday, June 29, 2026, 13:00-17:00
Participation Fee: 45,100 JPY (tax included) *Materials to be distributed electronically
URL: https://andtech.co.jp/seminars/1f142186-873f-66ee-88d1-064fb9a95405
WEB Streaming Format: Zoom (URL will be sent after application)
Seminar Content Structure
—Program and Lecturer—
Yoshihisa Kato, Visiting Professor, Fukuoka University Semiconductor Packaging Research Institute / Representative Director, Kato Packaging Research Institute
Knowledge and Technical Courses to Learn from This Seminar
・All technologies related to component embedding
・About component-embedded substrates
・Necessity and system of international standardization
・About Fukuoka University Semiconductor Packaging Research Institute and 3D Semiconductor Research Center
・International standardization activities for component-embedded substrates
Seminar Participation Format
This will be a live streaming seminar using the web conferencing tool "Zoom."
Details will be provided after application.
About AndTech Co., Ltd.
We provide R&D support services that offer information to clients responsible for R&D in a wide range of fields, including chemistry, materials, electronics, automobiles, energy, medical devices, food packaging, and building materials.
Our company boasts a team of top-tier lecturers and offers various services, starting with "Technical Training Courses and Seminars," followed by "Lecturer Dispatch," "Publishing," "Consultant Dispatch," "Market Trend Research," "Business Matching," and "Business Development Consulting."
We listen to our clients' voices and provide effective support for them to enter desired new business areas and markets.
https://andtech.co.jp/
AndTech Co., Ltd. Technical Training Course List
We hold numerous WEB lecture seminars by top-tier lecturers every month.
https://andtech.co.jp/seminars/search
AndTech Co., Ltd. Book List
We publish books on carefully selected themes with high demand.
https://andtech.co.jp/books
AndTech Co., Ltd. Consulting Services
We dispatch highly specialized technical consultants with extensive experience.
https://andtech.co.jp/business-consulting
Contact Regarding This Matter
AndTech Co., Ltd. Public Relations Representative: Aoki
Email: pr●andtech.co.jp (Please change ● to @ to contact)
All program items below (Please see if you are interested in details)
[Lecture Purpose]
In Japan and worldwide, the strengthening of semiconductor and digital industries (infrastructure) related to AI is rapidly progressing.
Packaging technology is essential for practical application of semiconductors, and 3D packaging is required to build high-density, high-functionality products. Component-embedded technology is a form of 3D packaging technology, offering benefits such as miniaturization, improved reliability, and enhanced high-frequency characteristics. This technology is also crucial for realizing an AI society, IoT society, and high-speed communication, where various things are connected via the internet.
This seminar will report on the development status of component-embedded substrates conducted at the Fukuoka University Semiconductor Packaging Research Institute and Fukuoka IST 3D Semiconductor Research Center. It will also explain the international standardization activities related to component-embedded substrates that Japan has led.
[Program]
1. About component-embedded substrates
1
Keywords:
Amidst the strengthening of the semiconductor and digital industries in Japan and globally for the AI era, packaging technology, especially 3D packaging that enables high density, is becoming crucial. Among these, component-embedded substrate technology contributes to miniaturization, improved reliability, and enhanced high-frequency characteristics, serving as a foundational technology supporting the AI/IoT society and high-speed communication. This seminar will explain the development achievements of component-embedded substrates by the Fukuoka University Semiconductor Packaging Research Institute and Fukuoka IST, as well as the international standardization activities led by Japan.
This seminar is scheduled to commence on Monday, June 29, 2026.
Details: https://andtech.co.jp/seminars/1f142186-873f-66ee-88d1-064fb9a95405
Live Streaming/WEB Seminar Overview
Theme: Current Status and Future Possibilities of Component-Embedded Substrate Technology as a Solution for High Integration and High Functionality
Date and Time: Monday, June 29, 2026, 13:00-17:00
Participation Fee: 45,100 JPY (tax included) *Materials to be distributed electronically
URL: https://andtech.co.jp/seminars/1f142186-873f-66ee-88d1-064fb9a95405
WEB Streaming Format: Zoom (URL will be sent after application)
Seminar Content Structure
—Program and Lecturer—
Yoshihisa Kato, Visiting Professor, Fukuoka University Semiconductor Packaging Research Institute / Representative Director, Kato Packaging Research Institute
Knowledge and Technical Courses to Learn from This Seminar
・All technologies related to component embedding
・About component-embedded substrates
・Necessity and system of international standardization
・About Fukuoka University Semiconductor Packaging Research Institute and 3D Semiconductor Research Center
・International standardization activities for component-embedded substrates
Seminar Participation Format
This will be a live streaming seminar using the web conferencing tool "Zoom."
Details will be provided after application.
About AndTech Co., Ltd.
We provide R&D support services that offer information to clients responsible for R&D in a wide range of fields, including chemistry, materials, electronics, automobiles, energy, medical devices, food packaging, and building materials.
Our company boasts a team of top-tier lecturers and offers various services, starting with "Technical Training Courses and Seminars," followed by "Lecturer Dispatch," "Publishing," "Consultant Dispatch," "Market Trend Research," "Business Matching," and "Business Development Consulting."
We listen to our clients' voices and provide effective support for them to enter desired new business areas and markets.
https://andtech.co.jp/
AndTech Co., Ltd. Technical Training Course List
We hold numerous WEB lecture seminars by top-tier lecturers every month.
https://andtech.co.jp/seminars/search
AndTech Co., Ltd. Book List
We publish books on carefully selected themes with high demand.
https://andtech.co.jp/books
AndTech Co., Ltd. Consulting Services
We dispatch highly specialized technical consultants with extensive experience.
https://andtech.co.jp/business-consulting
Contact Regarding This Matter
AndTech Co., Ltd. Public Relations Representative: Aoki
Email: pr●andtech.co.jp (Please change ● to @ to contact)
All program items below (Please see if you are interested in details)
[Lecture Purpose]
In Japan and worldwide, the strengthening of semiconductor and digital industries (infrastructure) related to AI is rapidly progressing.
Packaging technology is essential for practical application of semiconductors, and 3D packaging is required to build high-density, high-functionality products. Component-embedded technology is a form of 3D packaging technology, offering benefits such as miniaturization, improved reliability, and enhanced high-frequency characteristics. This technology is also crucial for realizing an AI society, IoT society, and high-speed communication, where various things are connected via the internet.
This seminar will report on the development status of component-embedded substrates conducted at the Fukuoka University Semiconductor Packaging Research Institute and Fukuoka IST 3D Semiconductor Research Center. It will also explain the international standardization activities related to component-embedded substrates that Japan has led.
[Program]
1. About component-embedded substrates
1
Keywords: