WEB Seminar on June 25 (Thu): "Development Trends in MLCC Manufacturing Process and Material Design, Functional Additives, and Conductive Pastes ~Barium Titanate Dielectrics, Particle Surface Characteristics and Binders, Conductive Pastes for MLCC Terminal Electrodes~" to be Held

AndTech Inc. (Headquarters: Kawasaki City, Kanagawa Prefecture, President: Masao Toyama, hereinafter AndTech) will open a course on "Manufacturing Process and Material Design" of "MLCC (Multilayer Ceramic Capacitors)".

This course is for engineers and researchers involved in multilayer ceramic electronic components, such as ceramic materials, electrode materials, organic binder materials, and organic solvents.

Mr. Wada from (formerly) Murata Manufacturing will provide an explanation of the MLCC manufacturing process, Big Chemie Japan will cover functional additives, and Namix will discuss the development of conductive pastes, offering a rich lineup of instructors!

Live Stream / WEB Seminar Outline

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Theme: Development Trends in MLCC Manufacturing Process and Material Design, Functional Additives, and Conductive Pastes ~Barium Titanate Dielectrics, Particle Surface Characteristics and Binders, Conductive Pastes for MLCC Terminal Electrodes~

Date and Time: June 25, 2026 (Thursday) 13:00-17:00

Participation Fee: 55,000 JPY (tax included) *Materials to be distributed electronically

URL: https://andtech.co.jp/seminars/1f13f9f8-5bc6-65cc-8af0-064fb9a95405

WEB Delivery Format: Zoom (URL will be sent after application)

Seminar Course Content Structure

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Lecture 1: 13:00-14:30 (Wada Engineering Office: Mr. Wada)

"Ceramic Material Design and Manufacturing Process of MLCC (Multilayer Ceramic Capacitors)"

Lecture 2: 13:00-14:15 (Big Chemie Japan: Mr. Wakahara)

"Functional Additives for MLCC (Multilayer Ceramic Capacitors)"

Lecture 3: 14:30-15:45 (Namix: Mr. Takahashi)

"Development Trends in Conductive Pastes for MLCC Terminal Electrodes"

Knowledge that can be gained and technical challenges that can be solved at this seminar

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① BaTiO3 ceramic material characteristics and material design points required for MLCC

② Overview of Ni internal electrode MLCC

③ Mechanism of particle dispersion stabilization (electrostatic repulsion, steric hindrance)

④ Structure and characteristics of wetting dispersants, and their influence on sheet strength

⑤ Challenges and solutions during dispersion liquid coating/drying (wetting, bubbles, rheology)

⑥ Basic knowledge and development trends regarding conductive pastes for electronic component terminal electrodes

All program items below (please see if you are interested in details)

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Part 1: Ceramic Material Design and Manufacturing Process of MLCC (Multilayer Ceramic Capacitors)

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Wada Engineering Office

Representative:

Nobuyuki Wada

[Lecture Objective]

This lecture will outline the design elements of ceramic BT materials mainly used in MLCCs and manufacturing process technologies for producing highly reliable MLCCs.

[Program]

1. Overview of Multilayer Ceramic Capacitors (MLCC)

Aluminum electrolytic capacitors, tantalum electrolytic capacitors, impedance, temperature compensation systems, high dielectric constant systems, F characteristics, B characteristics, core-shell structure

2. Overview of Ni Internal Electrode MLCC

Equilibrium oxygen partial pressure of metals, technological trends of BT materials, chip size, market forecast

3. Design of BaTiO3 (Barium Titanate; BT) Material for MLCC

3.1 Synthesis of fine BT powder: Solid-state method, oxalic acid method, hydrothermal synthesis method, size effect

3.2 Core-shell structure of B-characteristic BT material: Manufacturing process of BT raw materials, dispersion of additives, flattening of temperature characteristics

3.3 Reliability of BT material: Acceptor, donor, oxygen vacancy diffusion, accelerated life, grain boundary oxygen vacancy trapping, activation energy of oxygen vacancy diffusion, number of grain boundaries, wear failure, temperature acceleration

4. MLCC Manufacturing Process

4.1 Overview of manufacturing process: Thin sheets, peeling methods, lamination methods, warm water isostatic pressing

4.2 Composition of slurry for sheet forming: Binder, dispersant, plasticizer, PVC, sheet strength, adsorbed binder, free binder

4.3 Slurry dispersion process: Ball mill, bead mill, crushing bead diameter, bead specific gravity

4.4 Sheet forming process: Sheet drying, constant rate drying, sheet peelability, slurry dispersibility and sheet quality

4.5 Ni internal electrode coating process and sinterability: Fine Ni powder, sheet attack, sinterability, coverage, common material, electrode composition and reliability

4.6 MLCC firing process and firing atmosphere control: Debindering, main firing, thermal decomposition of binder, residual carbon, oxygen partial pressure control, short-time firing

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Part 2: Functional Additives for MLCC (Multilayer Ceramic Capacitors)

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