June 11 (Thursday) "Film and FPC Formation Technology for High-Frequency FPC Liquid Crystal Polymer (LCP) and Low-Dielectricization ~Case Studies of Compounding Methods and Development of Crushed LCP Microfiber Films~" Zoom Seminar to be Held

AndTech Inc. (Headquarters: Kawasaki City, Kanagawa Prefecture; President: Masao Suyama; hereinafter AndTech) will explain "FPC formation technology and low-dielectricization" of "Liquid Crystal Polymer for high-frequency FPC" as part of its R&D development support.

We will explain the characteristics of LCP film and the elemental technologies for forming multilayer FPCs!

Although there is increasing demand for FPCs using low-dielectric substrates capable of high-frequency response, LCP films, which are thermoplastic resins, require completely different technologies from conventional polyimide films when forming multilayer FPCs.

This lecture will introduce the concept for achieving both low-dielectric properties and basic characteristics as an FPC substrate, and practical examples of films developed using crushed LCP microfibers based on this concept.

Live Streaming / WEB Seminar Overview

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Theme: Film and FPC Formation Technology for High-Frequency FPC Liquid Crystal Polymer (LCP) and Low-Dielectricization ~Case Studies of Compounding Methods and Development of Crushed LCP Microfiber Films~

Date and Time: June 11, 2026 (Thursday) 13:00-17:00

Participation Fee: 45,100 JPY (tax included) *Materials to be distributed electronically

URL: https://andtech.co.jp/seminars/1f11e827-eac7-6f8a-be5f-064fb9a95405

WEB Streaming Format:

This will be a live streaming seminar using the web conferencing tool "Zoom".

Details will be provided after application.

Seminar Program Structure

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Instructor: Hiroyuki Ohata, Representative of FM Tech / (Former) Murata Manufacturing

Knowledge and Technical Issues Solved in this Seminar

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① Basic characteristics required for FPC substrates

② Reasons why LCP and polyimide films are used in FPC

③ Elemental technologies for LCP multilayering

④ Precautions during LCP film processing

⑤ Examples of hybridization methods of LCP with low-dielectric materials

All program items below (Please refer if you are interested in details)

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【About the Lecturer】

From 2000, he worked at Japan Gore-Tex Co., Ltd., and from 2011, at Murata Manufacturing Co., Ltd., where he developed materials for high-frequency FPC (mainly LCP-FCCL and hybrid substrates of LCP and low-dielectric resin) and elemental technologies for LCP multilayer FPC formation processes using them (surface treatment, press material composition, press conditions).

He retired from Murata Manufacturing Co., Ltd. in December 2021 and is currently active as a technology consultant "FM Tech" specializing in high-frequency FPC materials and FPC formation processes.

【Program】

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1. Instructor Self-Introduction

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1-1 Career and Development Achievements (Focusing on filed patents)

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2. FPC Basics

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2-1 General Structure

2-2 Required Characteristics of FPC Substrates

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3. LCP-FPC

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3-1 What is LCP?

3-2 History of LCP Film/FPC Development

3-3 Structure and Process of LCP-FPC

(Material composition, multilayer process)

3-4 Improving Adhesion through Surface Treatment

(Hydrolysis countermeasures, high-frequency characteristics)

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4. LCP Film/FCCL

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4-1 How to Make LCP Film/FCCL

(Melt extruded film + lamination, solution casting)

4-2 Problems of LCP Film/FCCL

(Melt extruded type: heat resistance limits, compounding; Solution casting type: water absorption)

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5. Reasons why LCP and Polyimide are Used in FPC Substrates

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5-1 Importance of CTE Control

5-2 Similarities between LCP and PI

5-3 CTE Control Methods

(Why orientation control reduces CTE to metal-like levels?)

5-4 Other Problems when Using Random Coil Type Resins

(Thermal shrinkage during heating process, entropy