June 24 (Wed) "Slurry Dispersion/Aggregation Mechanism, Zeta Potential Evaluation, and Stabilization Design through Powder Surface Modification" Zoom Seminar to be Held

AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture; Representative Director and President: Masao Suyama; hereinafter AndTech) will explain the "Slurry Dispersion/Aggregation Mechanism" and "Stabilization Design" as part of its R&D development support.

For slurry stability, controlling the powder-liquid interface is crucial.

This course will organize the basics of dispersion/aggregation mechanisms and zeta potential, then explain dispersion stabilization technologies through powder surface modification, such as surfactant adsorption, polymer adsorption, and coupling treatment.

You can learn design guidelines applicable to a wide range of fields, including battery materials, electronic materials, and ceramics.

Live Streaming / Web Seminar Outline

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Theme: Slurry Dispersion/Aggregation Mechanism, Zeta Potential Evaluation, and Stabilization Design through Powder Surface Modification

Date and Time: Wednesday, June 24, 2026, 13:00-17:00

Archived Viewing: Available

Participation Fee: 45,100 JPY (tax included) *Materials to be distributed electronically

URL: https://andtech.co.jp/seminars/1f112110-e668-6004-9a3f-064fb9a95405

Web Streaming Format:

This will be a live streaming seminar using the web conferencing tool "Zoom."

Details will be provided after application.

Seminar Course Content Structure

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Lecturer: Professor Mitsumasa Kimata, Department of Chemistry and Biotechnology, Graduate School of Science and Engineering, Yamagata University

Knowledge and Technical Challenges Solvable in this Seminar

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① You will be able to understand the adhesive forces acting between powder particles.

② You will be able to understand zeta potential, which is necessary for understanding slurry dispersion and aggregation.

③ You will be able to learn several methods for modifying the surface of powders.

All program items below (please see if you are interested in details)

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[About the Lecturer]

With a background in chemical engineering, he prepares functional powders using chemical synthesis methods in the liquid phase and mechanochemical methods by pulverization. He also conducts a wide range of research on powders, including measurement of powder properties and DEM simulations.

[Program]

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1. Introduction (Overview)

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2. Slurry Dispersion/Aggregation Mechanism

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2.1 Stirring operation and slurry preparation

2.2 Size and shape of powder particles

2.3 Adhesive forces acting between powder particles

2.4 Affinity between powder and solvent (wettability)

2.5 Aggregation rate of particles, hydrophobic interaction

2.6 Surface potential and zeta potential

2.7 Dispersion and aggregation of powders in liquid phase (DLVO theory)

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3. Evaluation Methods for Slurry Dispersion/Aggregation

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3.1 Measurement of zeta potential

3.2 Measurement of turbidity and pressure

3.3 Measurement of particle size distribution

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4. Slurry Dispersion Stabilization Methods through Powder Surface Modification

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4.1 Adsorption phenomena

4.2 Surface modification by surfactant adsorption

4.3 Surface modification by water-soluble polymer adsorption

4.4 Surface modification by coupling agent treatment

4.5 Surface modification by polymer coating

4.6 Surface modification by mechanochemical method

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5. Conclusion (Summary) & Q&A

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About AndTech Co., Ltd.

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We provide R&D support services that offer information to clients responsible for R&D in a wide range of fields, including chemistry, materials, electronics, automobiles, energy, medical devices, food packaging, and building materials.

Our company boasts a team of top-tier instructors and offers various services, starting with "Technical Workshops and Seminars," followed by "Lecturer Dispatch," "Publishing," "Consultant Dispatch," "Market Trend Research," "Business Matching," and "Business Development Consulting."

We listen to our clients' voices and provide effective support to help them enter desired new business areas and markets.