AndTech to Hold WEB Online Zoom Seminar on "Semiconductor Miniaturization and Advanced Packaging Latest Technologies ~ Trends, Technical Challenges, and Future Prospects of Resist, Lithography, Packaging Resist, and RDL Formation Processes ~" on May 28th (Thursday)

AndTech Inc. (Headquarters: Kawasaki City, Kanagawa Prefecture, President: Masao Suyama, hereinafter AndTech) will offer a Zoom course as part of its R&D support, focusing on semiconductor miniaturization. The course, titled "Semiconductor Miniaturization and Advanced Packaging Latest Technologies ~ Trends, Technical Challenges, and Future Prospects of Resist, Lithography, Packaging Resist, and RDL Formation Processes ~," will be led by leading experts in the field. To meet the demand for high-speed, low-power consumption in data centers driven by the evolution of generative AI, semiconductor miniaturization and advanced packaging technologies are becoming increasingly important. This lecture will present the latest roadmaps for both technologies, explaining cutting-edge resist technologies such as EUV metal resist and dry resist, lithography trends, and the challenges and prospects of RDL formation processes. This course will provide a systematic understanding from the fundamentals and latest trends of miniaturization and packaging technologies to their business positioning. This course is scheduled to commence on Thursday, May 28th, 2026. Details: https://andtech.co.jp/seminars/1f11db3e-3604-6e22-b916-064fb9a95405

・Live Streaming WEB Seminar Overview

Theme: Semiconductor Miniaturization and Advanced Packaging Latest Technologies ~ Trends, Technical Challenges, and Future Prospects of Resist, Lithography, Packaging Resist, and RDL Formation Processes ~ Date and Time: Thursday, May 28th, 2026, 10:00 - 17:00 Participation Fee: 49,500 yen (tax included) *Materials will be distributed electronically. URL: https://andtech.co.jp/seminars/1f11db3e-3604-6e22-b916-064fb9a95405 WEB Streaming Format: Zoom (URL will be sent after registration)

・Seminar Content Structure

- Program and Lecturer - Masataka Endo, Representative, E-Reso Research

・Knowledge to be Gained and Technical Courses to be Solved in this Seminar

- Trends in semiconductor miniaturization (resist, lithography) technologies. - Trends in advanced semiconductor packaging technologies. - Characteristics and applications of packaging resists. - Trends in the fine redistribution layer (RDL) formation process.

・Seminar Participation Format

This will be a live streaming seminar using the web conferencing tool "Zoom." Details will be provided after registration.

・AndTech Inc.