AndTech to Hold WEB Online Zoom Seminar on "Semiconductor Miniaturization and Advanced Packaging Latest Technologies ~ Trends, Technical Challenges, and Future Prospects of Resist, Lithography, Packaging Resist, and RDL Formation Processes ~" on May 28th (Thursday)
AndTech will host an online seminar on semiconductor miniaturization and advanced packaging technologies.
📋 Article Processing Timeline
- 📰 Published: March 31, 2026 at 01:52
- 🔍 Collected: March 30, 2026 at 22:56
- 🤖 AI Analyzed: April 15, 2026 at 10:53 (371h 57m after Collected)
AndTech Inc. (Headquarters: Kawasaki City, Kanagawa Prefecture, President: Masao Suyama, hereinafter AndTech) will offer a Zoom course as part of its R&D support, focusing on semiconductor miniaturization. The course, titled "Semiconductor Miniaturization and Advanced Packaging Latest Technologies ~ Trends, Technical Challenges, and Future Prospects of Resist, Lithography, Packaging Resist, and RDL Formation Processes ~," will be led by leading experts in the field.
To meet the demand for high-speed, low-power consumption in data centers driven by the evolution of generative AI, semiconductor miniaturization and advanced packaging technologies are becoming increasingly important. This lecture will present the latest roadmaps for both technologies, explaining cutting-edge resist technologies such as EUV metal resist and dry resist, lithography trends, and the challenges and prospects of RDL formation processes. This course will provide a systematic understanding from the fundamentals and latest trends of miniaturization and packaging technologies to their business positioning.
This course is scheduled to commence on Thursday, May 28th, 2026.
Details: https://andtech.co.jp/seminars/1f11db3e-3604-6e22-b916-064fb9a95405
Live Streaming WEB Seminar Overview
Theme: Semiconductor Miniaturization and Advanced Packaging Latest Technologies ~ Trends, Technical Challenges, and Future Prospects of Resist, Lithography, Packaging Resist, and RDL Formation Processes ~
Date and Time: Thursday, May 28th, 2026, 10:00 - 17:00
Participation Fee: 49,500 yen (tax included) *Materials will be distributed electronically.
URL: https://andtech.co.jp/seminars/1f11db3e-3604-6e22-b916-064fb9a95405
WEB Streaming Format: Zoom (URL will be sent after registration)
Seminar Content Structure
- Program and Lecturer -
Masataka Endo, Representative, E-Reso Research
Knowledge to be Gained and Technical Courses to be Solved in this Seminar
- Trends in semiconductor miniaturization (resist, lithography) technologies.
- Trends in advanced semiconductor packaging technologies.
- Characteristics and applications of packaging resists.
- Trends in the fine redistribution layer (RDL) formation process.
Seminar Participation Format
This will be a live streaming seminar using the web conferencing tool "Zoom." Details will be provided after registration.
AndTech Inc.
FAQ
What is the main topic of the AndTech seminar?
The seminar focuses on the latest technologies in semiconductor miniaturization and advanced packaging, including trends, technical challenges, and future prospects related to resist, lithography, packaging resist, and RDL formation processes.
When and how will the seminar be held?
The seminar will be held online via Zoom on Thursday, May 28th, 2026, from 10:00 to 17:00. A Zoom URL will be sent after registration.
What is the participation fee for the seminar?
The participation fee is 49,500 yen (tax included). Course materials will be distributed electronically.
Who is the lecturer for this seminar?
The lecturer is Masataka Endo, Representative of E-Reso Research.
What specific topics will be covered in the seminar?
The seminar will cover trends in semiconductor miniaturization (resist, lithography) technologies, advanced semiconductor packaging technologies, characteristics and applications of packaging resists, and trends in the fine redistribution layer (RDL) formation process.