AndTech to Hold WEB Online Zoom Seminar on May 14 (Thursday): "Overview of Semiconductor CMP Technology, Material Removal Mechanisms, Trends in Abrasive Particle Development and Slurry Dispersibility Evaluation, and Characteristics of Post-Cleaning"
AndTech Co., Ltd. will hold a WEB online Zoom seminar on May 14, 2026, focusing on semiconductor CMP technology. This seminar aims to address the growing needs for solutions in semiconductor CMP technology, featuring leading experts who will explain the overview of CMP/cleaning processes, material removal mechanisms, abrasive particle development, slurry dispersibility evaluation, and post-cleaning characteristics.
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AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture; Representative Director and President: Masao Toyama; hereinafter "AndTech") will hold a "Semiconductor CMP Technology" seminar as part of its R&D development support Zoom courses. This seminar aims to meet the increasing demand for solutions in semiconductor CMP technology, featuring leading experts.
The seminar will cover an overview and characteristics of CMP and cleaning processes in semiconductor manufacturing, followed by "the relationship between abrasive particle properties and functions from the perspective of material and abrasive manufacturers, and how to handle them with precautions," "research results visualizing slurry behavior at the contact interface during CMP processing using contact image analysis and in-situ observation techniques," and "dispersibility evaluation of CMP slurry using zeta potential, and methods for measuring wafer zeta potential and evaluating electrostatic interactions."
This course is scheduled to commence on May 14, 2026.
Details: https://andtech.co.jp/seminars/1f11e98b-a593-63b4-b280-064fb9a95405
Live Streaming / WEB Seminar Outline
──────────────────
Theme: Overview of CMP Technology for Semiconductor Miniaturization and High Performance, Material Removal Mechanisms, Trends in Abrasive Particle Development and Slurry Dispersibility Evaluation, and Characteristics of Post-Cleaning
Date and Time: Thursday, May 14, 2026, 10:30-16:50
Participation Fee: 60,500 yen (tax included) *Materials to be distributed electronically
URL: https://andtech.co.jp/seminars/1f11e98b-a593-63b4-b280-064fb9a95405
WEB Delivery Format: Zoom (URL will be sent after application)
Seminar Course Content Structure
────────────
—Program and Lecturers—
∽∽───────────────────────∽∽
Part 1: Overview of Chemical Mechanical Polishing (CMP) Technology in Semiconductor Manufacturing and Characteristics of Post-CMP Cleaning
∽∽───────────────────────∽∽
Lecturer: Masayoshi Imai, Technical Marketing Section, Equipment Business Division, Precision & Electronics Company, Ebara Corporation
∽∽───────────────────────∽∽
Part 2: Material Removal Mechanisms in CMP —Understanding Based on Visualization of Auxiliary Materials (Pads and Slurry)—
∽∽───────────────────────∽∽
Lecturer: Michio Uneda, Professor, Department of Mechanical Engineering, Faculty of Engineering, Gifu University, Tokai National Higher Education and Research System
∽∽───────────────────────∽∽
Part 3: Characteristics of Silica-based Particles and Application Technology for Semiconductor Polishing
∽∽───────────────────────∽∽
Lecturer: JGC Catalysts & Chemicals Ltd., Fine Research Institute MM First Research
Keywords: Semiconductor, CMP, Cleaning, Polishing Head, Slurry, Silica Abrasive, Nanoparticles, Dispersion, Seminar, Lecture
The seminar will cover an overview and characteristics of CMP and cleaning processes in semiconductor manufacturing, followed by "the relationship between abrasive particle properties and functions from the perspective of material and abrasive manufacturers, and how to handle them with precautions," "research results visualizing slurry behavior at the contact interface during CMP processing using contact image analysis and in-situ observation techniques," and "dispersibility evaluation of CMP slurry using zeta potential, and methods for measuring wafer zeta potential and evaluating electrostatic interactions."
This course is scheduled to commence on May 14, 2026.
Details: https://andtech.co.jp/seminars/1f11e98b-a593-63b4-b280-064fb9a95405
Live Streaming / WEB Seminar Outline
──────────────────
Theme: Overview of CMP Technology for Semiconductor Miniaturization and High Performance, Material Removal Mechanisms, Trends in Abrasive Particle Development and Slurry Dispersibility Evaluation, and Characteristics of Post-Cleaning
Date and Time: Thursday, May 14, 2026, 10:30-16:50
Participation Fee: 60,500 yen (tax included) *Materials to be distributed electronically
URL: https://andtech.co.jp/seminars/1f11e98b-a593-63b4-b280-064fb9a95405
WEB Delivery Format: Zoom (URL will be sent after application)
Seminar Course Content Structure
────────────
—Program and Lecturers—
∽∽───────────────────────∽∽
Part 1: Overview of Chemical Mechanical Polishing (CMP) Technology in Semiconductor Manufacturing and Characteristics of Post-CMP Cleaning
∽∽───────────────────────∽∽
Lecturer: Masayoshi Imai, Technical Marketing Section, Equipment Business Division, Precision & Electronics Company, Ebara Corporation
∽∽───────────────────────∽∽
Part 2: Material Removal Mechanisms in CMP —Understanding Based on Visualization of Auxiliary Materials (Pads and Slurry)—
∽∽───────────────────────∽∽
Lecturer: Michio Uneda, Professor, Department of Mechanical Engineering, Faculty of Engineering, Gifu University, Tokai National Higher Education and Research System
∽∽───────────────────────∽∽
Part 3: Characteristics of Silica-based Particles and Application Technology for Semiconductor Polishing
∽∽───────────────────────∽∽
Lecturer: JGC Catalysts & Chemicals Ltd., Fine Research Institute MM First Research
Keywords: Semiconductor, CMP, Cleaning, Polishing Head, Slurry, Silica Abrasive, Nanoparticles, Dispersion, Seminar, Lecture