[Winbond] Announcement of Changes to the Risk Management Committee
Winbond Electronics has announced changes to its Risk Management Committee following the expiration of terms. Chiang Shang-yi has been appointed to replace outgoing member Hsu Shan-ko.
📋 Article Processing Timeline
- 📰 Published: May 29, 2026 at 09:00
- 🔍 Collected: May 30, 2026 at 08:00 (23h 0m after Published)
- 🤖 AI Analyzed: May 31, 2026 at 17:16 (33h 15m after Collected)
1. Date of change: May 29, 2026
2. Committee name: Risk Management Committee
3. Former members: Jiao You-jun, Hsu Shan-ko, Zuo Da-chuan, Kuan Chung-ming, Li Zhong-pei
4. New members: Jiao You-jun, Chiang Shang-yi, Zuo Da-chuan, Kuan Chung-ming, Li Zhong-pei
5. Reason for change: Expiration of term and reappointment
6. Effective date: May 29, 2026
2. Committee name: Risk Management Committee
3. Former members: Jiao You-jun, Hsu Shan-ko, Zuo Da-chuan, Kuan Chung-ming, Li Zhong-pei
4. New members: Jiao You-jun, Chiang Shang-yi, Zuo Da-chuan, Kuan Chung-ming, Li Zhong-pei
5. Reason for change: Expiration of term and reappointment
6. Effective date: May 29, 2026
FAQ
What is the significance of Chiang Shang-yi joining Winbond's committee?
His extensive semiconductor industry experience is expected to enhance the committee's risk management expertise and overall corporate governance.