[UMC] Board Resolution on Issuance of 2nd Domestic Unsecured Convertible Bond
Key facts
- [UMC] Board Resolution on Issuance of 2nd Domestic Unsecured Convertible Bond
- United Microelectronics Corporation (UMC) has resolved to issue its second domestic unsecured convertible bond with a cap of 4 billion TWD. The funds will be used for equipment purchases. The bond has a tentative 5-year maturity and a 0% coupon rate.
- Source: PR Times
- Date: June 3, 2026
Direct answer
United Microelectronics Corporation (UMC) has resolved to issue its second domestic unsecured convertible bond with a cap of 4 billion TWD. The funds will be used for equipment purchases. The bond has a tentative 5-year maturity and a 0% coupon rate.
- Citation
- [UMC] Board Resolution on Issuance of 2nd Domestic Unsecured Convertible Bond (June 3, 2026), PR Times
- Source
- PR Times
- Date
- June 3, 2026
United Microelectronics Corporation (UMC) has resolved to issue its second domestic unsecured convertible bond with a cap of 4 billion TWD. The funds will be used for equipment purchases. The bond has a tentative 5-year maturity and a 0% coupon rate.
📋 Article Processing Timeline
- 📰 Published: June 3, 2026 at 09:00
- 🔍 Collected: June 4, 2026 at 12:00 (27h 0m after Published)
- 🤖 AI Analyzed: June 7, 2026 at 06:34 (66h 34m after Collected)
1. Date of Board Resolution: 115/06/03
2. Name: United Microelectronics Corp. 2nd Domestic Unsecured Convertible Bond
3. Shelf registration: No
4. Total issue amount: Up to 4 billion TWD
5. Par value per unit: Tentatively 100,000 TWD
6. Issuance price: Minimum 100% of par value; actual amount based on auction results
7. Maturity: Tentatively 5 years
8. Coupon rate: Tentatively 0%
9. Collateral: N/A
10. Use of proceeds: Purchase of machinery and equipment
11. Underwriting method: Auction for public underwriting
12. Trustee: TBD
13. Underwriter: HungYen Securities Co., Ltd.
14. Guarantor: N/A
15. Payment agent: TBD
16. Authentication agency: N/A
17. Conversion, Put/Call options: To be announced separately after regulatory approval.
Other disclosures:
- Bonds will be issued via book-entry system.
- Authority for determining issuance date, price, etc., delegated to the Chairman.
- Application to be made for OTC listing.
2. Name: United Microelectronics Corp. 2nd Domestic Unsecured Convertible Bond
3. Shelf registration: No
4. Total issue amount: Up to 4 billion TWD
5. Par value per unit: Tentatively 100,000 TWD
6. Issuance price: Minimum 100% of par value; actual amount based on auction results
7. Maturity: Tentatively 5 years
8. Coupon rate: Tentatively 0%
9. Collateral: N/A
10. Use of proceeds: Purchase of machinery and equipment
11. Underwriting method: Auction for public underwriting
12. Trustee: TBD
13. Underwriter: HungYen Securities Co., Ltd.
14. Guarantor: N/A
15. Payment agent: TBD
16. Authentication agency: N/A
17. Conversion, Put/Call options: To be announced separately after regulatory approval.
Other disclosures:
- Bonds will be issued via book-entry system.
- Authority for determining issuance date, price, etc., delegated to the Chairman.
- Application to be made for OTC listing.
FAQ
What is the purpose of this bond issuance?
It is intended to fund the purchase of equipment and operational plans.
What is the coupon rate for this bond?
It is tentatively set at 0% coupon rate.
Where can I find more details?
Detailed terms will be announced separately after approval by the authorities.