Seminar Titled 'How to Use Heat Dissipation Devices and Basics of Thermal Design' by Hirokazu Shibata, CEO of Zazoo Design Co., Ltd., to be Held on Wednesday, May 20, 2026!!

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How to Use Heat Dissipation Devices and Basics of Thermal Design

- Covering the key points of heat dissipation in EVs, smartphones, PCs, data centers, etc. -

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[Seminar Details]

https://www.ssk21.co.jp/S0000103.php?spage=pt_26199

[Speaker]

Mr. Hirokazu Shibata, President & CEO, Zazoo Design Co., Ltd.

[Date & Time]

Wednesday, May 20, 2026, 1:00 PM - 5:00 PM

[How to Attend]

Live broadcast (Zoom Webinar)

Archived broadcast (Available for viewing at your convenience for 2 weeks)

[Key Lecture Content]

As the importance of thermal design increases in daily operations, learning the big picture of thermal design typically requires going through entire books on thermal engineering. However, books on thermal engineering are often difficult for beginners to grasp quickly, starting from the basics of heat transfer, temperature boundary layers, and dimensionless numbers related to heat transfer.

This seminar is intended for engineers who will start thermal design in the future. It uses various heat dissipation devices as specific subjects, aiming to help participants grasp the basics of thermal design while learning the characteristics and usage of these devices. The goal after attending this seminar is to acquire knowledge equivalent to studying a book on thermal engineering in its entirety.

1. Current Status and Challenges of Thermal Design

(1) Rapid increase in power density

(2) Shift from atmospheric heat dissipation to board heat dissipation

(3) Shift from convection-dominant to conduction-dominant

(4) Emergence of liquid cooling and immersion cooling

2. 'Thermal Resistance' Determines the Heat Dissipation Path

(1) Thermal resistance as a practical experience

(2) Heat dissipation path is determined by internal thermal resistance

(3) Definition of thermal resistance

(4) Series and parallel thermal resistance

3. Basic Laws Governing Heat Transfer

(1) Heat conduction (heat transfer between solids)

(2) Heat convection (heat transfer between solid and liquid)

(3) Dimensionless numbers in heat convection

(4) Radiative heat transfer (heat transfer via electromagnetic waves)

4. Air Cooling by Heat Convection

(1) Determining heat sink parameters

(2) Spreading thermal resistance

(3) Airflow and static pressure of axial fans

(4) Pressure loss and flow rate

5. Thermal Diffusion by Heat Conduction

(1) Role of TIM (Thermal Interface Material)

(2) Thermal properties of TIM

(3) Mechanical properties of TIM

(4) Characteristics of graphite sheets

6. Heat Transfer by Gas-Liquid Two-Phase Flow

(1) Thermosyphon

(2) Heat pipes

(3) Vapor chambers

7. Q&A

[Contact Information]