TOMOEGAWA's Breathable Heater "iCas MCT" Adopted in Nikon's Semiconductor Lithography Systems, Contributing to Precise Temperature Control

TOMOEGAWA CORPORATION (Headquarters: Chuo-ku, Tokyo; President: Yusuke Inoue) has announced that its developed breathable heater component, "iCas MCT," has been adopted by Nikon Corporation (Headquarters: Shinagawa-ku, Tokyo; President and CEO: Yasuhiro Omura, hereinafter Nikon) for its semiconductor lithography systems. This system is scheduled to be sold starting in December 2026. This is the first time that our breathable heater component "iCas MCT" has been adopted for a semiconductor lithography system. Semiconductor Lithography System NSR-S215D (Nikon Corporation) Development Background In the semiconductor field, addressing the growing demand for semiconductors and reducing manufacturing costs are ongoing challenges. Amid this, semiconductor lithography systems, which play a central role in the semiconductor manufacturing process, require technology that can form complex and fine electronic circuit patterns on silicon wafers with high precision while also contributing to improved productivity and energy efficiency. Even slight temperature fluctuations can affect pattern accuracy, making high-precision and high-speed temperature control on the order of mK (millikelvins) essential, especially inside the lithography system. In such precise temperature control, shortening the thermal response time is crucial and directly linked to improving the equipment's productivity and energy efficiency. About iCas MCT The breathable heater component "iCas MCT" is a new product developed for this application, and this is the first time it has been adopted for a semiconductor lithography system. "iCas MCT" is a heater component that uses a paper-like, porous "stainless steel fiber sheet" as its heating element. By adopting a stainless steel fiber sheet with a porous structure, the heater component itself can be made breathable, allowing it to effectively heat while air passes through it perpendicular to the heating surface. This structure allows for high thermal responsiveness and heating performance while keeping the heat capacity of the component low. It also contributes to the miniaturization and weight reduction of parts, contributing to the high performance of semiconductor lithography systems. Heater Introduction Site: "Flexible Surface Heater iCas MHE" (TOMOEGAWA CORPORATION Website) Breathable Heater Component iCas MCT (TOMOEGAWA CORPORATION) Future Development Under our solution brand "iCas," which controls heat, electricity, and electromagnetic waves, we are continuing to develop and expand products and technologies for various applications. We will continue to contribute to the development of advanced industries, including the semiconductor manufacturing field, through product development that contributes to improving energy efficiency and equipment performance.