Macnica and Misora Connect Begin Joint Provision of Chip SIMs for Industrial IoT

Macnica, Inc. (Headquarters: Yokohama, Kanagawa; President: Kazumasa Hara; hereinafter "Macnica") and Misora Connect, Inc. (Headquarters: Bunkyo-ku, Tokyo; President: Nobumichi Morita; hereinafter "Misora Connect") are pleased to announce that they will begin providing industrial-grade "Chip SIMs" (semiconductor type) for industrial IoT devices starting today, March 26, 2026, to further promote the utilization of LTE communication in industrial IoT.

■ Background

With the expansion of the IoT market, demand for mobile communication is increasing across a wide variety of IoT devices beyond just smartphones. Furthermore, the fields utilizing connected devices are diverse, including the mobility sector, industrial equipment, and various outdoor-installed meters and terminals. In these areas, the mainstream method has traditionally been to perform cellular communication by inserting a physical SIM into the device to utilize mobile networks provided by telecommunications carriers.

On the other hand, industrial IoT devices are required to handle harsher environmental conditions and operational requirements compared to general IoT devices, such as high and low temperatures, strong vibrations, and long-term outdoor use. Additionally, as devices become smaller and more densely packed, the space required for a physical SIM slot becomes a design constraint. There are also challenges such as the operational burden of inserting, replacing, and configuring SIMs during mass production or on-site installation, as well as the risks of theft and unauthorized use. Against this background, the use of industrial-grade "Chip SIMs" (semiconductor type) is attracting significant attention.

■ Features of "Chip SIM"

As a means to ensure the high environmental resistance and reliability required for industrial IoT devices while simultaneously reducing design and operational burdens, the two companies will provide MFF2 size (5mm x 6mm) "Chip SIMs" that are soldered directly onto the IoT device's circuit board. This product supports a wide operating temperature range of -40°C to +105°C and possesses industrial-grade vibration and shock resistance, enabling stable communication even in harsh industrial environments. The structure of mounting directly to the board makes it less susceptible to temperature changes, vibration, and moisture, significantly improving the durability of the entire product and the reliability of the communication connection.

Furthermore, by providing tamper resistance, it minimizes security risks associated with the removal of physical SIMs. By eliminating the need for a physical SIM slot, it also contributes to device miniaturization and high-density mounting.

■ Initiatives of Both Companies

By combining the "semiconductor-quality support system" leveraging the semiconductor logistics and technical know-how of Macnica, a semiconductor trading company, with the "flexible communication plans" of Misora Connect, a full MVNO*1, the two companies will provide an optimal communication and device introduction environment tailored to the applications and operations of customers, including industrial IoT equipment manufacturers. Furthermore, since appropriate communication plans can be proposed based on the volume and frequency of communication data and the intended use, it is possible to achieve cost optimization...